NOTES:
REVISION BA
C
1.
REPRESENTS A CRITICAL DIMENSION.
HW-XX-XX-XX-X-XXXX-SM-X-XXX
2. TUBE POSITIONS -05 THRU -36 ONLY; POSITIONS -02
THRU -04 TO BE LAYER PACKAGED.
No OF POSITIONS
-02 THRU -36
OPTION #2
POLARIZED POSITION
SPECIFY OMITTED PIN
3. MAXIMUM CUT FLASH: .020 [0.51] CUT FLASH TO BE
IN A NON-CRITICAL AREA LOCATED BETWEEN BODIES.
4. FOR ADDED MECHANICAL STABILITY, SAMTEC RECOMMENDS
MECHANICAL BOARD SPACERS BE USED IN APPLICATIONS WITH
GOLD OR SELECTIVE GOLD PLATED CONNECTORS. CONTACT
IPG@SAMTEC.COM FOR MORE INFORMATION.
DO NOT
SCALE FROM
THIS PRINT
LEAD STYLE
OPTION #1
(SEE TABLE 1)
-LC: LOCKING CLIP (SEE FIG 2, SHT 2)
(-D: USE RTSM-50-DVU, USE LC-05-TM)
(-S: USE TSM-50-SV BODY, USE LC-08-TM-02)
-A: ALIGNMENT PIN (SEE FIG 3, SHT 2)
(-S: 3 POSITION USE TSM-03-SV-A,
MUST BE MOLDED TO POSITION)
(4-50 POSITIONS USE TSM-XX-SV-XX,
2 POSITIONS TO USE TSM-48-SV-04)
(-D: FOR MOLDED TO POSITION,
USE RTSM-50-DVU-XX BODY,
PLATING SPECIFICATION
36
02
-T: MATTE TIN ON CONTACT AND TAIL.
-S: 30µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL.
-G: 10µ" SELECTIVE GOLD IN CONTACT AREA,
3µ" SELECTIVE GOLD ON TAIL.
-L: 10µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL.
-TL: 250µ" TIN/LEAD ON CONTACT AND TAIL.
-H: 30µ" SELECTIVE GOLD IN CONTACT
AREA, 3µ" SELECTIVE GOLD ON TAIL.
-F: 3µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL.
.195 4.95
REF
35
01
MAX SWAY
2
.100 2.54 REF
(EITHER DIRECTION)
AVAILABLE ON POS -02 THRU -36)
(-D: FOR STAKED, USE RTSM-50-DVU BODY,
3 POS MIN)
-S: SINGLE ROW
02
72
-TR: TAPE & REEL
(4 THRU 27 POSITIONS ONLY)
(MAX HEIGHT: .6875)
-TM: MATTE TIN ON CONTACT AND TAIL.
-SM: 30µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL.
-LM: 10µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL.
.295 7.49
REF
LEAVE BLANK FOR NO HOLD DOWN OPTION
(-D: USE RTSM-50-DVU, CAN BE CUT
TO POSITION, SEE FIG 1)
(-S: USE TSM-50-SV, CAN BE CUT
TO POSITION, SEE FIG 1)
01
71
MAX SWAY
(EITHER DIRECTION)
-FM: 3µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL.
2
.200 5.08 REF
SURFACE MOUNT
ROW OPTION
FIG 1
-D: DOUBLE ROW
HW-XX-10-XX-X-675-SM SHOWN
(USE RTSM-50-DVU FOR BOTTOM INSULATOR)
(USE WRTSM-50-DVU FOR TOP INSULATOR)
-S: SINGLE ROW
(USE TSM-XX-S BODY FOR BOTTOM INSULATOR)
(USE WTSM-50-SV FOR TOP INSULATOR)
BOARD SPACE
"A" = -XXX
(SEE FIG 1 & TABLE 1)
MAX= C + .150
+.000[0.00]
(NO OF POS x .100[2.54])
- .015[0.38]
"B" .000[0.00] MIN
C
(NO OF POS -1) x .100[2.54]
[("C" + .150[3.81]) -A]
.025 0.64 SQ
REF (TYP)
.050 1.27
WTSM-50-SV
.100 2.54
.100 2.54 REF
C
T-1S6-XX-XX-2
WRTSM-50-DVU
"A"±.008[0.20]
BOARD OPTION
(.250[6.35] MIN)
(SEE TABLE 1)
"H" REF
+5°
- 0°
(MAX = "C" + .150[3.81])
90°
C
.100 2.54 REF
.006[0.15]
TSM-50-SV
.050 1.27
RTSM-50-DVU
-S: SINGLE ROW
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS CONFIDENTIAL AND
*
*
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
PROPRIETARY INFORMATION AND ALL DESIGN,
MANUFACTURING, REPRODUCTION, USE, PATENT RIGHTS
AND SALES RIGHTS ARE EXPRESSLY RESERVED BY SAMTEC,
INC. THIS DOCUMENT SHALL NOT BE DISCLOSED, IN WHOLE
OR PART, TO ANY UNAUTHORIZED PERSON OR ENTITY NOR
REPRODUCED, TRANSFERRED OR INCORPORATED IN ANY
OTHER PROJECT IN ANY MANNER WITHOUT THE EXPRESS
WRITTEN CONSENT OF SAMTEC, INC.
DECIMALS
ANGLES
.XX: .01 [0.3]
2
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733 FAX: 812-948-5047
e-Mail info@SAMTEC.com code 55322
.XXX: .005 [0.13]
.XXXX: .0020 [0.051]
SHEET SCALE: 2:1
MATERIAL:
DO NOT SCALE DRAWING
DESCRIPTION:
INSULATOR: LCP, UL 94 V0, COLOR: BLACK
TERMINAL: PHOS BRONZE
HW BOARD TO BOARD ASSEMBLY
DWG. NO.
HW-XX-XX-XX-X-XXXX-SM-X-XXX
SHEET 1 OF
BY: G PURVIS 03/12/1993
3
F:\DWG\MISC\MKTG\HW-XX-XX-XX-X-XXXX-SM-X-XXX-MKT.SLDDRW
5秒后页面跳转
TLP250光耦合器：资料手册参数分析
DA14580 低功耗蓝牙系统级芯片(SoC)：资料手册参数分析
INA226 高精度电流和功率监控器：资料手册参数分析
SI2302 N沟道MOSFET：资料手册参数分析
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
数据手册
如果您发现信息不准确，
