Spec. No. : Preliminary Data
Issued Date : 1998.07.01
Revised Date : 1999.08.01
Page No. : 1/5
HI-SINCERITY
MICROELECTRONICS CORP.
HU603AL
N-Channel Logic Level Enhancement Mode Field Effect Transistor
Description
This very high density process has been especially tailored to minimize on-
state resistance and provide superior switching performance. These
devices are particularly suited for low voltage applications such as DC/DC
converters and other battery powered circuits where fast switching, low in-
line power loss, and resistance to transients are needed.
(Ta=25°C)
Absolute Maximum Ratings
• Maximum Temperatures
Operating and Storage Temperature................................................................................ -65 ~ +175 °C
• Maximum Power Dissipation
Total Power Dissipation at Tc=25°C ............................................................................................... 60 W
Derate Above 25°C................................................................................................................ 0.4 W / °C
• Maximum Voltages and Currents
Drain-Source Voltage...................................................................................................................... 30 V
Gate-Source Voltage -Continuous................................................................................................. ±20 V
Drain Current -Continuous .............................................................................................................. 30 A
Drain Current -Pulsed ................................................................................................................... 100 A
Thermal Resistance, Junction-to-Case .................................................................................. 2.5 °C / W
Thermal Resistance, Junction-to-Ambient............................................................................ 62.5 °C / W
Electrical Characteristics
• Off Characteristics
Symbol
BVDSS
IDSS
+IGSS
-IGSS
Parameter
Condition
VGS=0V, ID=250uA
VDS=30V, VGS=0V
VGS=20V, VDS=0V
VGS=-20V, VDS=0V
Min Typ Max Unit
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage ,Forward
Gate-Body Leakage ,Reverse
30
-
-
-
-
-
-
10
V
uA
-
-
100 nA
-100 nA
• On Characteristics
VDS=VGS, ID=250uA
VDS=VGS, ID=10mA
VGS=10V, ID=25A
VGS=4.5V, ID=10A
VGS=10V, VDS=10V
VGS=4.5V, VDS=10V
VDS=10V, ID=25A
1.1
1.4
-
-
-
3
V
3
VGS(TH)
Gate Threshold Voltage
0.018 0.022
0.029 0.040
-
-
26
RDS(on) Static Drain-Source On-Resistance
IDS(on) On-State Drain Current
Ω
-
60
15
-
-
-
-
A
S
gFS
Forward Transconductance
• Dynamic Characteristic
Ciss
Coss
Crss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
-
-
-
1100
600
180
-
-
-
pF
pF
pF
VDS=15V, VGS=0V
f=1.0Mhz
HSMC Product Specification