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HU603AL

更新时间: 2024-11-11 22:33:43
品牌 Logo 应用领域
HSMC 晶体晶体管场效应晶体管
页数 文件大小 规格书
5页 63K
描述
N-Channel Logic Level Enhancement Mode Field Effect Transistor

HU603AL 技术参数

生命周期:Obsolete包装说明:,
Reach Compliance Code:unknown风险等级:5.84
Base Number Matches:1

HU603AL 数据手册

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Spec. No. : Preliminary Data  
Issued Date : 1998.07.01  
Revised Date : 1999.08.01  
Page No. : 1/5  
HI-SINCERITY  
MICROELECTRONICS CORP.  
HU603AL  
N-Channel Logic Level Enhancement Mode Field Effect Transistor  
Description  
This very high density process has been especially tailored to minimize on-  
state resistance and provide superior switching performance. These  
devices are particularly suited for low voltage applications such as DC/DC  
converters and other battery powered circuits where fast switching, low in-  
line power loss, and resistance to transients are needed.  
(Ta=25°C)  
Absolute Maximum Ratings  
Maximum Temperatures  
Operating and Storage Temperature................................................................................ -65 ~ +175 °C  
Maximum Power Dissipation  
Total Power Dissipation at Tc=25°C ............................................................................................... 60 W  
Derate Above 25°C................................................................................................................ 0.4 W / °C  
Maximum Voltages and Currents  
Drain-Source Voltage...................................................................................................................... 30 V  
Gate-Source Voltage -Continuous................................................................................................. ±20 V  
Drain Current -Continuous .............................................................................................................. 30 A  
Drain Current -Pulsed ................................................................................................................... 100 A  
Thermal Resistance, Junction-to-Case .................................................................................. 2.5 °C / W  
Thermal Resistance, Junction-to-Ambient............................................................................ 62.5 °C / W  
Electrical Characteristics  
Off Characteristics  
Symbol  
BVDSS  
IDSS  
+IGSS  
-IGSS  
Parameter  
Condition  
VGS=0V, ID=250uA  
VDS=30V, VGS=0V  
VGS=20V, VDS=0V  
VGS=-20V, VDS=0V  
Min Typ Max Unit  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Body Leakage ,Forward  
Gate-Body Leakage ,Reverse  
30  
-
-
-
-
-
-
10  
V
uA  
-
-
100 nA  
-100 nA  
On Characteristics  
VDS=VGS, ID=250uA  
VDS=VGS, ID=10mA  
VGS=10V, ID=25A  
VGS=4.5V, ID=10A  
VGS=10V, VDS=10V  
VGS=4.5V, VDS=10V  
VDS=10V, ID=25A  
1.1  
1.4  
-
-
-
3
V
3
VGS(TH)  
Gate Threshold Voltage  
0.018 0.022  
0.029 0.040  
-
-
26  
RDS(on) Static Drain-Source On-Resistance  
IDS(on) On-State Drain Current  
-
60  
15  
-
-
-
-
A
S
gFS  
Forward Transconductance  
Dynamic Characteristic  
Ciss  
Coss  
Crss  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
-
-
-
1100  
600  
180  
-
-
-
pF  
pF  
pF  
VDS=15V, VGS=0V  
f=1.0Mhz  
HSMC Product Specification  

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