Datasheet > HTCICC6403FUG/AM

HTCICC6403FUG/AM

更新时间： 2024-09-21 15:34:19

品牌	Logo	应用领域
恩智浦 - NXP		电信电信集成电路
页数	文件大小	规格书
13页	317K
描述
SPECIALTY TELECOM CIRCUIT, UUC5, WAFER, 5 PIN

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HTCICC6403FUG/AM 技术参数

HTCICC64

HITAG µ RO64 transponder IC

Rev. 3.1 — 24 July 2009

176431

Product data sheet

PUBLIC

1. General description

The HITAG product line is well known and established in the contactless identification

market.

Due to the open marketing strategy of NXP Semiconductors there are various

manufacturers well established for both the transponder / cards as well as the Read/Write

Devices. All of them supporting HITAG transponder IC’s.

With the new HITAG µ RO64, NXP is addressing the low end LF market, by offering a

preprogrammed, read only IC variant.

The advantages of this transponder IC are:

proven HITAG performance

easy to assemble because of mega-bumps

low cost manufacturing because of preprogrammed TTF code

The HITAG µ RO64 operates in a continuous TTF mode where it modulates the reader

field with it’s preprogrammed 64-bit memory content.

2. Features

2.1 Features

Integrated circuit for contactless identification transponders and cards

Integrated resonance capacitor of 210 pF with ± 3% tolerance or 280 pF with ± 5%

tolerance over full production

Frequency range 100 kHz to 150 kHz

64-bit preprogrammed TTF response

10 years data retention

2.2 Delivery types

Sawn, megabumped wafer, 150 μm, 8 inch, UV

12 3 4 5 6 7...13

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型号	品牌	获取价格	描述	数据表
HTCICC6403FUG/AM,0	NXP	获取价格	HTCICC6402FUG - HITAG RO64 Transponder IC
HTCICC6403FUGAM	NXP	获取价格	HITAG Î¼ RO64 transponder IC
HTCM106	HAMMOND	获取价格	Module de cablage de toit et panneaux lateraux
HTCM126	HAMMOND	获取价格	Module de cablage de toit et panneaux lateraux
HTCM3106	HAMMOND	获取价格	Module de cablage de toit et panneaux lateraux
HTCM3126	HAMMOND	获取价格	Module de cablage de toit et panneaux lateraux
HTCM346	HAMMOND	获取价格	Module de cablage de toit et panneaux lateraux
HTCM366	HAMMOND	获取价格	Module de cablage de toit et panneaux lateraux
HTCM386	HAMMOND	获取价格	Module de cablage de toit et panneaux lateraux
HTCM400	NXP	获取价格	HITAG core module hardware