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HT6256DC PDF预览

HT6256DC

更新时间: 2024-09-21 03:42:59
品牌 Logo 应用领域
霍尼韦尔 - HONEYWELL 存储内存集成电路静态存储器
页数 文件大小 规格书
8页 69K
描述
HIGH TEMPERATURE 32K x 8 STATIC RAM

HT6256DC 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:DIP包装说明:DIP, DIP28,.6
针数:28Reach Compliance Code:unknown
ECCN代码:3A001.A.2.AHTS代码:8542.32.00.41
风险等级:5.55Is Samacsys:N
最长访问时间:50 nsI/O 类型:COMMON
JESD-30 代码:R-CDIP-T28JESD-609代码:e0
长度:35.56 mm内存密度:262144 bit
内存集成电路类型:STANDARD SRAM内存宽度:8
功能数量:1端子数量:28
字数:32768 words字数代码:32000
工作模式:ASYNCHRONOUS最高工作温度:225 °C
最低工作温度:-55 °C组织:32KX8
输出特性:3-STATE封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装代码:DIP封装等效代码:DIP28,.6
封装形状:RECTANGULAR封装形式:IN-LINE
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
电源:5 V认证状态:Not Qualified
座面最大高度:4.445 mm最大待机电流:0.00033 A
最小待机电流:2.5 V子类别:SRAMs
最大压摆率:0.004 mA最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:NO技术:MOS
温度等级:MILITARY端子面层:Tin/Lead (Sn/Pb)
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:15.24 mmBase Number Matches:1

HT6256DC 数据手册

 浏览型号HT6256DC的Datasheet PDF文件第2页浏览型号HT6256DC的Datasheet PDF文件第3页浏览型号HT6256DC的Datasheet PDF文件第4页浏览型号HT6256DC的Datasheet PDF文件第5页浏览型号HT6256DC的Datasheet PDF文件第6页浏览型号HT6256DC的Datasheet PDF文件第7页 
HTMOSTM High Temperature Products  
HIGH TEMPERATURE 32K x 8 STATIC RAM  
HT6256  
FEATURES  
APPLICATONS  
• Specified Over -55 to +225°C  
• Down-Hole Oil Well  
• Avionics  
• Fabricated with HTMOS™ IV Silicon on Insulator (SOI)  
• Read/Write Cycle Times 50 ns Support 20 MHz Clock  
• Asynchronous Operation  
• Turbine Engine Control  
• Industrial Process Control  
• Nuclear Reactor  
• CMOS Input/Output Buffers  
• Single 5 V ± 10% Power Supply  
• Electric Power Conversion  
• Hermetic 28-Lead Ceramic DIP  
• Heavy Duty Internal Combustion Engines  
GENERAL DESCRIPTION  
PACKAGE PINOUT  
The 32K x 8 High Temperature Static RAM is a high  
performance 32,768 word x 8-bit static random access  
memory with industry-standard functionality. It is fabri-  
cated with Honeywell’s HTMOS™ technology, and is  
designed for use in systems operating in severe high  
temperature environments.  
A14  
A12  
A7  
A6  
A5  
A4  
A3  
A2  
A1  
1
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
VDD  
NWE  
A13  
A8  
2
3
4
5
A9  
6
A11  
NOE  
A10  
NCS  
DQ7  
DQ6  
DQ5  
DQ4  
DQ3  
Top  
View  
7
The RAM requires only a single 5 V ± 10% power supply  
and has CMOS compatible I/O. Power consumption is  
typically less than 30 mW/MHz in operation, and less than  
10 mW when de-selected. The RAM read operation is fully  
asynchronous, with an associated typical access time of  
50 ns at 5 V.  
8
9
A0  
10  
11  
12  
13  
14  
DQ0  
DQ1  
DQ2  
VSS  
The RAM provides guaranteed performance over the full  
-55 to +225°C temperature range. Typically, parts will  
operate up to +300°C for a year, with derated perfor-  
mance. All parts are burned in at 250°C to eliminate infant  
mortality.  
Solid State Electronics Center • 12001 State Highway 55, Plymouth, MN 55441 • (800) 323-8295 • http://www.ssec.honeywell.com  

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