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HSMP-3894-BLKG PDF预览

HSMP-3894-BLKG

更新时间: 2024-11-25 19:22:55
品牌 Logo 应用领域
安捷伦 - AGILENT 开关测试光电二极管
页数 文件大小 规格书
12页 161K
描述
Pin Diode, 100V V(BR), Silicon, LEAD FREE, SOT-23, 3 PIN

HSMP-3894-BLKG 技术参数

是否Rohs认证: 符合生命周期:Transferred
零件包装代码:SOT-23包装说明:R-PDSO-G3
针数:3Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8541.10.00.80
风险等级:5.04应用:SWITCHING
最小击穿电压:100 V配置:COMMON CATHODE, 2 ELEMENTS
最大二极管电容:0.3 pF标称二极管电容:0.2 pF
二极管元件材料:SILICON最大二极管正向电阻:2.5 Ω
二极管电阻测试电流:5 mA二极管电阻测试频率:100 MHz
二极管类型:PIN DIODEJESD-30 代码:R-PDSO-G3
JESD-609代码:e3少数载流子标称寿命:0.2 µs
元件数量:2端子数量:3
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED认证状态:Not Qualified
反向测试电压:5 V子类别:PIN Diodes
表面贴装:YES技术:POSITIVE-INTRINSIC-NEGATIVE
端子面层:MATTE TIN端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

HSMP-3894-BLKG 数据手册

 浏览型号HSMP-3894-BLKG的Datasheet PDF文件第2页浏览型号HSMP-3894-BLKG的Datasheet PDF文件第3页浏览型号HSMP-3894-BLKG的Datasheet PDF文件第4页浏览型号HSMP-3894-BLKG的Datasheet PDF文件第5页浏览型号HSMP-3894-BLKG的Datasheet PDF文件第6页浏览型号HSMP-3894-BLKG的Datasheet PDF文件第7页 
Surface Mount RF PIN  
Switch Diodes  
Technical Data  
HSMP-389x Series  
HSMP-489x Series  
Pin Connections and  
Package Marking  
Features  
Description/Applications  
The HSMP-389x series is  
Unique Configurations in  
Surface Mount Packages  
– Add Flexibility  
optimized for switching applica-  
tions where low resistance at low  
current and low capacitance are  
required. The HSMP-489x series  
products feature ultra low  
parasitic inductance. These  
products are specifically  
designed for use at frequencies  
which are much higher than the  
upper limit for conventional PIN  
diodes.  
1
2
3
6
5
4
– Save Board Space  
– Reduce Cost  
Switching  
– Low Capacitance  
– Low Resistance at Low  
Current  
Notes:  
1. Package marking provides  
orientation, identification, and  
date code.  
2. See “Electrical Specifications” for  
appropriate package marking.  
Low Failure in Time (FIT)  
Rate[1]  
Matched Diodes for  
Consistent Performance  
Better Thermal  
Conductivity for Higher  
Power Dissipation  
Lead-free Option Available  
Note:  
1. For more information see the  
Surface Mount PIN Reliability Data  
Sheet.  

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