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HSMC-S660 PDF预览

HSMC-S660

更新时间: 2024-11-11 04:22:19
品牌 Logo 应用领域
安捷伦 - AGILENT /
页数 文件大小 规格书
11页 205K
描述
High Performance Surface Mount Chip LEDs

HSMC-S660 技术参数

生命周期:Transferred包装说明:3.00 MM X 2.00 MM, 1.00 MM HEIGHT, SMD-2
Reach Compliance Code:unknownHTS代码:8541.40.20.00
风险等级:5.34颜色:RED
颜色@波长:Red配置:SINGLE
最大正向电流:0.03 A最大正向电压:2.4 V
透镜类型:DIFFUSED标称发光强度:50.0 mcd
安装特点:SURFACE MOUNT功能数量:1
端子数量:2最高工作温度:85 °C
最低工作温度:-40 °C光电设备类型:SINGLE COLOR LED
总高度:2 mm包装方法:TAPE AND REEL
峰值波长:630 nm最大反向电压:5 V
形状:RECTANGULAR尺寸:2 mm
子类别:Visible LEDs表面贴装:YES
端子节距:2.2 mm视角:155 deg
Base Number Matches:1

HSMC-S660 数据手册

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High Performance Surface Mount  
Chip LEDs  
Technical Data  
SunPower Series  
HSMx-S660 Series  
HSMx-S670 Series  
HSMx-S690 Series  
Features  
Description  
• High Brightness AlInGaP  
Material  
These chip-type LEDs utilize  
aluminum indium gallium  
phosphide (AlInGaP) material  
technology. The AlInGaP material  
has a very high luminous  
efficiency, capable of producing  
high light output over a wide  
range of drive currents. The 590  
nm amber, 605 nm orange, and  
626 nm red colors are available  
in three compact, low profile  
packages.  
• Industry Standard 2.00 x  
1.25 mm Package  
• Industry Standard 1.6 x 0.8  
mm (Low Profile) Package  
• Right Angle Package  
• Three Colors Available  
• Diffused Optics  
• Compatible with IR Solder  
Process  
applications. The HSMx-S660  
right angle, 3.0 x 2.0 x 1.0 mm  
LED is optimum for side lighting  
applications where direct back-  
lighting is not practical.  
• Available in 8 mm Tape on  
7” (178 mm) Diameter Reels  
The HSMx-S670 is the industry  
standard 2.0 x 1.25 mm package,  
and is an excellent all around  
package. The HSMx-S690 is the  
industry standard 1.6 x 0.8 mm  
package. Its low 0.7 mm profile  
and wide viewing angle make this  
LED excellent for backlighting  
Applications  
• Keypad Backlighting  
• LCD Backlighting  
• Symbol Backlighting  
• Front Panel Indicator  
All packages are compatible with  
IR and convective reflow solder-  
ing processes.  
Device Selection Guide  
Footprint  
(mm) [1][2]  
Amber  
590 nm  
Orange  
605 nm  
Red  
626 nm  
1.6 x 0.8 x 0.7  
2.0 x 1.25 x 0.8  
3.0 x 2.0 x 1.0  
HSMA-S690  
HSMA-S670  
HSMA-S660  
HSMD-S690  
HSMD-S670  
HSMD-S660  
HSMC-S690  
HSMC-S670  
HSMC-S660  
Notes:  
1. Dimensions in mm.  
2. Tolerance ± 0.1 mm unless otherwise noted.  

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