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HSMA-R761 PDF预览

HSMA-R761

更新时间: 2024-11-12 19:46:43
品牌 Logo 应用领域
安捷伦 - AGILENT 光电
页数 文件大小 规格书
10页 217K
描述
Single Color LED, Amber, Diffused, 1.4mm

HSMA-R761 技术参数

是否Rohs认证:不符合生命周期:Transferred
Reach Compliance Code:unknownHTS代码:8541.40.20.00
风险等级:5.21Is Samacsys:N
其他特性:HIGH RELIABILITY颜色:AMBER
颜色@波长:Amber配置:SINGLE
最大正向电流:0.02 A最大正向电压:2.4 V
JESD-609代码:e0透镜类型:DIFFUSED
标称发光强度:35 mcd安装特点:SURFACE MOUNT
功能数量:1端子数量:2
最高工作温度:85 °C最低工作温度:-40 °C
光电设备类型:SINGLE COLOR LED总高度:1.3 mm
包装方法:TAPE AND REEL峰值波长:592 nm
最大反向电压:5 V形状:RECTANGULAR
尺寸:1.4 mm子类别:Visible LEDs
表面贴装:YES端子面层:Tin/Lead (Sn/Pb)
端子节距:2.4 mm视角:165 deg
Base Number Matches:1

HSMA-R761 数据手册

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High Performance Surface  
Mount Flip Chip LEDs  
Technical Data  
HP SunPower Series  
HSMA-H670/H690/H770/  
H790/R661/R761  
HSMC-H670/H690/H770/  
H790/R661/R761  
HSML-H670/H690/H770/  
H790/R661/R761  
Applications  
Features  
• Keypad Backlighting  
• LCD Backlighting  
• Symbol Backlighting  
• Front Panel Indicator  
• High Brightness AlInGaP  
Material  
• Improved Reliability  
through Elimination of  
Internal Wire Bond  
• -40 to 85°C Operating  
Temperature Range  
Description  
The HSMx-H670/H770, -H690/  
H790, and -R661/R761 combine  
high reliability surface mount flip  
chip LED construction with HP’s  
bright AlInGaP material. These  
very small, bright LEDs have a  
high luminous efficiency capable  
of producing high light output over  
a wide range of drive currents. The  
590 nm amber, 605 nm orange,  
and 626 nm red colors are  
• Three Small Package Sizes  
• Industry Standard  
2.0 x 1.25 mm and  
1.6 x 0.8 mm Footprints  
H790 has the industry standard  
1.6 x 0.8 mm footprint, and its low  
0.6 mm profile and wide viewing  
angle make this LED excellent for  
backlighting applications.  
• Right Angle Package  
• Three Colors Available  
• Diffused Optics  
• Compatible with IR and  
Through-the-wave Solder  
Processes  
• Available in 8 mm Tape on  
178 mm (7") and 330 mm  
(13") Diameter Reels  
The HSMx-R661/R761 has a small  
2.1 x 1.3 mm footprint and a low  
profile 0.7 mm height that makes  
this part ideal for LCD backlighting  
and sidelighting applications  
where space is at a premium. All  
packages are compatible with IR  
and convective reflow soldering  
processes. In addition, these parts  
are also compatible with through-  
the-wave soldering processes.  
available in three compact, low  
profile packages.  
The HSMx-H670/H770 has the  
industry standard 2.0 x 1.25 mm  
footprint that is excellent for all  
around use. The HSMx-H690/  

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