Datasheet > HSM2694

HSM2694

更新时间： 2024-09-14 12:04:59

品牌	Logo	应用领域
TYSEMI		二极管光电二极管局域网
页数	文件大小	规格书
1页	59K
描述
MPAK package is suitable for high density surface mounting and high speed assembly

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中文翻译

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数据手册

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HSM2694 数据手册

Product specification

HSM2694

SOT-23

Unit: mm

+0.1

-0.1

2.9

0.4

+0.1

-0.1

Features

Low forward resistance. (rf = 0.9 max)

+0.1

0.95

-0.1

+0.05

0.1

-0.01

Low capacitance. (C = 1.2pFmax)

+0.1

-0.1

1.9

MPAK package is suitable for high density surface mounting and high speed assembly.

1.Base

2.Emitter

3.collector

A b so lu te M a xim u m R a tin g s T a = 2 5

P a ra m e te r

R e ve rse V o lta g e

S ym b o l

V R

V a lu e

3 5

U n it

P o w e r d issip a tio n

P d

1 5 0

m W

Ju n ctio n te m p e ra tu re

S to ra g e te m p e ra tu re

O p e ra tio n te m p e ra tu re

T j

1 2 5

T stg

T o p r

-4 5 to + 1 2 5

-2 0 to + 6 0

Electrical Characteristics Ta = 25

Parameter

Reverse voltage

Symbol

Conditions

IR = 10

Min

Typ

Max

Unit

Reverse current

Forward voltage

Capacitance

VR = 25 V

IF = 10 mA

1.0

1.2

0.9

VR = 6 V, f = 1 MHz

IF = 2 mA, f = 100 MHz

Forward resistance

Marking

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4008-318-123

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