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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| HS72T31X8X19 | TDK |
获取价格 |
Toroid Cores (Mn-Zn) |
|
| HS72T38X14X22 | TDK |
获取价格 |
Toroid Cores (Mn-Zn) |
|
| HS72T44.5X13X30 | TDK |
获取价格 |
Toroid Cores (Mn-Zn) |
|
| HS7302E-L | FOXCONN |
获取价格 |
Board Connector, 2 Contact(s), 1 Row(s), Male, Straight, 0.059 inch Pitch, Surface Mount T |
|
| HS7303E | FOXCONN |
获取价格 |
Board Connector, 3 Contact(s), 1 Row(s), Male, Straight, 0.059 inch Pitch, Surface Mount T |
|
| HS7303E-L | FOXCONN |
获取价格 |
Board Connector, 3 Contact(s), 1 Row(s), Male, Straight, 0.059 inch Pitch, Surface Mount T |
|
| HS7304E | FOXCONN |
获取价格 |
Board Connector, 4 Contact(s), 1 Row(s), Male, Straight, 0.059 inch Pitch, Surface Mount T |
|
| HS7304E-L | FOXCONN |
获取价格 |
Board Connector, 4 Contact(s), 1 Row(s), Male, Straight, 0.059 inch Pitch, Surface Mount T |
|
| HS-7321 | BOSER |
获取价格 |
Intel Core 2 Duo/Celeron M processor PICMG1.3 Half-size SBC w/CF |
|
| HS-7321DVI-I | BOSER |
获取价格 |
Intel Core 2 Duo/Celeron M processor PICMG1.3 Half-size SBC w/CF |
|
三星深化印度制造布局，供应链本地化进程加速
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意法半导体发布第四代SiC技术，助力电动汽车电驱
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