creat by ART
HS3AB - HS3MB
3.0AMPS High Efficient Surface Mount Rectifiers
SMB/DO-214AA
RoHS
Pb
COMPLIANCE
Features
Glass passivated junction chip.
For surface mounted application
Low forward voltage drop
Low profile package
Built-in stain relief, ideal for automatic
placement
Fast switching for high efficiency
High temperature soldering:
260℃/10 seconds at terminals
Plastic material used carries Underwriters
Laboratory Classification 94V-0
Green compound with suffix "G" on packing
code & prefix "G" on datecode
Dimensions in inches and (millimeters)
Marking Diagram
Mechanical Data
Case: Molded plastic
HS3XB = Specific Device Code
Terminal: Pure tin plated, lead free
Polarity: Indicated by cathode band
Packing: 12mm tape per EIA STD RS-481
Weight: 0.093 grams
G
Y
= Green Compound
= Year
M
= Work Month
Maximum Ratings and Electrical Characteristics
Rating at 25 ℃ ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
HS
3AB
50
HS
3BB
100
HS
3DB
200
HS
3FB
300
HS
3GB
400
HS
3JB
600
HS
HS
Symbol
Unit
Type Number
Maximum Repetitive Peak Reverse Voltage
3KB 3MB
VRRM
VRMS
VDC
800
560
800
1000
700
V
V
V
A
Maximum RMS Voltage
35
50
70
140
200
210
300
280
400
420
600
Maximum DC Blocking Voltage
100
1000
Maximum Average Forward Rectified Current
IF(AV)
3
Peak Forward Surge Current, 8.3 ms Single Half Sine-
wave Superimposed on Rated Load (JEDEC method)
IFSM
VF
IR
100
A
V
Maximum Instantaneous Forward Voltage (Note 1)
@ 3 A
1.0
1.3
1.7
10
Maximum Reverse Current @ Rated VR TA=25 ℃
uA
T
Maximum Reverse Recovery Time (Note 2)
Typical Junction Capacitance (Note 3)
Typical Thermal Resistance
A=125 ℃
250
50
80
75
50
Trr
Cj
nS
pF
OC/W
OC
OC
RθjA
TJ
60
Operating Temperature Range
- 55 to + 150
- 55 to + 150
Storage Temperature Range
TSTG
Note 1: Pulse Test with PW=300 usec, 1% Duty Cycle
Note 2: Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A
Note 3: Measured at 1 MHz and Applied Reverse Voltage of 4.0V D.C.
Version:G11