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HM5257405BTD-A6 PDF预览

HM5257405BTD-A6

更新时间: 2024-10-26 23:16:43
品牌 Logo 应用领域
尔必达 - ELPIDA 存储内存集成电路光电二极管动态存储器PC时钟
页数 文件大小 规格书
62页 455K
描述
512M LVTTL interface SDRAM 133 MHz/100 MHz 8-Mword 】 16-bit 】 4-bank/16-Mword 】 8-bit 】 4-bank /32-Mword 】 4-bit 】 4-bank PC/133, PC/100 SDRAM

HM5257405BTD-A6 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:TSOP2包装说明:TSOP2, TSOP54,.46,32
针数:54Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.28
风险等级:5.63访问模式:FOUR BANK PAGE BURST
最长访问时间:6 ns其他特性:AUTO/SELF REFRESH
最大时钟频率 (fCLK):100 MHzI/O 类型:COMMON
交错的突发长度:1,2,4,8JESD-30 代码:R-PDSO-G54
JESD-609代码:e0长度:22.22 mm
内存密度:536870912 bit内存集成电路类型:SYNCHRONOUS DRAM
内存宽度:4功能数量:1
端口数量:1端子数量:54
字数:134217728 words字数代码:128000000
工作模式:SYNCHRONOUS最高工作温度:60 °C
最低工作温度:组织:128MX4
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:TSOP2封装等效代码:TSOP54,.46,32
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
峰值回流温度(摄氏度):NOT SPECIFIED电源:3.3 V
认证状态:Not Qualified刷新周期:8192
座面最大高度:1.2 mm自我刷新:YES
连续突发长度:1,2,4,8最大待机电流:0.004 A
子类别:DRAMs最大压摆率:0.33 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子节距:0.8 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:10.16 mm
Base Number Matches:1

HM5257405BTD-A6 数据手册

 浏览型号HM5257405BTD-A6的Datasheet PDF文件第2页浏览型号HM5257405BTD-A6的Datasheet PDF文件第3页浏览型号HM5257405BTD-A6的Datasheet PDF文件第4页浏览型号HM5257405BTD-A6的Datasheet PDF文件第5页浏览型号HM5257405BTD-A6的Datasheet PDF文件第6页浏览型号HM5257405BTD-A6的Datasheet PDF文件第7页 
HM5257165B-75/A6  
HM5257805B-75/A6  
HM5257405B-75/A6  
512M LVTTL interface SDRAM  
133 MHz/100 MHz  
8-Mword × 16-bit × 4-bank/16-Mword × 8-bit × 4-bank  
/32-Mword × 4-bit × 4-bank  
PC/133, PC/100 SDRAM  
E0081H10 (1st edition)  
(Previous ADE-203-1237A (Z))  
Jan. 31, 2001  
Description  
The HM5257165B is a 512-Mbit SDRAM organized as 8388608-word × 16-bit × 4 bank. The HM5257805B  
is a 512-Mbit SDRAM organized as 16777216-word × 8-bit × 4 bank. The HM5257405B is a 512-Mbit  
SDRAM organized as 33554432-word × 4-bit × 4 bank. All inputs and outputs are referred to the rising edge  
of the clock input. It is packaged in standard 54-pin plastic TSOP II.  
Features  
3.3 V power supply  
Clock frequency: 133 MHz/100 MHz (max)  
LVTTL interface  
Single pulsed RAS  
4 banks can operate simultaneously and independently  
Burst read/write operation and burst read/single write operation capability  
Programmable burst length: 1/2/4/8  
2 variations of burst sequence  
Sequential (BL = 1/2/4/8)  
Interleave (BL = 1/2/4/8)  
Elpida Memory, Inc. is a joint venture DRAM company of NEC Corporation and Hitachi, Ltd.  

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