是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
Reach Compliance Code: | unknown | 风险等级: | 5.77 |
最长访问时间: | 55 ns | I/O 类型: | COMMON |
JESD-30 代码: | R-GDIP-T28 | JESD-609代码: | e0 |
内存密度: | 65536 bit | 内存集成电路类型: | STANDARD SRAM |
内存宽度: | 8 | 功能数量: | 1 |
端口数量: | 1 | 端子数量: | 28 |
字数: | 8192 words | 字数代码: | 8000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 组织: | 8KX8 |
输出特性: | 3-STATE | 可输出: | YES |
封装主体材料: | CERAMIC, GLASS-SEALED | 封装代码: | DIP |
封装等效代码: | DIP28,.6 | 封装形状: | RECTANGULAR |
封装形式: | IN-LINE | 并行/串行: | PARALLEL |
峰值回流温度(摄氏度): | NOT SPECIFIED | 电源: | 5 V |
认证状态: | Not Qualified | 最大待机电流: | 0.02 A |
最小待机电流: | 4.5 V | 子类别: | SRAMs |
最大压摆率: | 0.125 mA | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 4.5 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | NO | 技术: | CMOS |
温度等级: | MILITARY | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | THROUGH-HOLE | 端子节距: | 2.54 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
HM1E-65764N-5+ | TEMIC |
获取价格 |
Standard SRAM, 8KX8, 55ns, CMOS, CDIP28, | |
HM1E-65764N-5D | TEMIC |
获取价格 |
8KX8 STANDARD SRAM, 55ns, CDIP28, 0.600 INCH, CERAMIC, DIP-28 | |
HM1E-65764N-8 | ETC |
获取价格 |
x8 SRAM | |
HM1E-65764N-9 | ETC |
获取价格 |
x8 SRAM | |
HM1E-65764N-9+ | TEMIC |
获取价格 |
Standard SRAM, 8KX8, 55ns, CMOS, CDIP28, | |
HM1E-65764N-A | TEMIC |
获取价格 |
Standard SRAM, 8KX8, 55ns, CMOS, CDIP28, | |
HM1E-65764N-A:D | TEMIC |
获取价格 |
Standard SRAM, 8KX8, 55ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28 | |
HM1E-65764N-AD | TEMIC |
获取价格 |
8KX8 STANDARD SRAM, 55ns, CDIP28, 0.600 INCH, CERAMIC, DIP-28 | |
HM1E-65779M-5+ | TEMIC |
获取价格 |
Standard SRAM, 8KX9, 45ns, CMOS, CDIP28, | |
HM1F41FAP000H5 | AMPHENOL |
获取价格 |
Board Connector, 24 Contact(s), 4 Row(s), Female, Right Angle, 0.079 inch Pitch, Solder Te |