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HLMP-6753 PDF预览

HLMP-6753

更新时间: 2024-02-21 22:09:43
品牌 Logo 应用领域
安捷伦 - AGILENT /
页数 文件大小 规格书
14页 241K
描述
Subminiature LED Lamps

HLMP-6753 数据手册

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H
Subminiature LED Lamps  
Technical Data  
HLMP-PXXX Series  
HLMP-QXXX Series  
HLMP-6XXX Series  
HLMP-70XX Series  
Features  
Dome Packages  
• Subminiature Flat Top  
Package  
The HLMP-6XXX Series dome  
lamps for use as indicators use  
a tinted, diffused lens to provide  
a wide viewing angle with a  
high on-off contrast ratio. High  
brightness lamps use an  
untinted, nondiffused lens to  
provide a high luminous  
intensity within a narrow  
radiation pattern.  
Ideal for Backlighting and  
Light Piping Applications  
• Subminiature Dome  
Package  
Diffused Dome for Wide  
Viewing Angle  
Nondiffused Dome for High  
Brightness  
• Arrays  
Arrays  
• TTL and LSTTL  
Compatible 5 Volt Resistor  
Lamps  
• Available in Six Colors  
• Ideal for Space Limited  
Applications  
The HLMP-66XX Series  
subminiature lamp arrays are  
available in lengths of 3 to 8  
elements per array. The  
luminous intensity is matched  
within an array to assure a 2.1  
to 1.0 ratio.  
surface mount lead configura-  
tions, gull wing, yoke lead or Z-  
bend. Right angle lead bends at  
2.54 mm (0.100 inch) and  
5.08 mm (0.200 inch) center  
spacing are available for  
through hole mounting. For  
more information refer to  
Standard SMT and Through  
Hole Lead Bend Options for  
Subminiature LED Lamps data  
sheet.  
• Axial Leads  
• Available with Lead  
Configurations for Surface  
Mount and Through Hole  
PC Board Mounting  
Resistor Lamps  
The HLMP-6XXX Series 5 volt  
subminiature lamps with built  
in current limiting resistors are  
for use in applications where  
space is at a premium.  
Description  
Flat Top Package  
The HLMP-PXXX Series flat top  
lamps use an untinted, non-  
diffused, truncated lens to  
provide a wide radiation pattern  
that is necessary for use in  
backlighting applications. The  
flat top lamps are also ideal for  
use as emitters in light pipe  
applications.  
Lead Configurations  
All of these devices are made by  
encapsulating LED chips on  
axial lead frames to form molded  
epoxy subminiature lamp  
packages. A variety of package  
configuration options is avail-  
able. These include special  
5964-9350E  
1-174  

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