COST-EFFECTIVE
RELIABLESOCKET
(2.54 mm) .100" PITCH • HLE SERIES
HLE
NO. PINS
PER ROW
PLATING
OPTION
TAIL
OTHER
HLE
1
02
- -
DV
- -
Board Mates:
-
-
OPTION
OPTION
TSW, MTSW, DW, EW,
ZW, TLW, TSM, MTLW, HW
Leave blank for
Surface Mount
(Requires –BE for
Bottom Entry)
02 thru 50
–F
–BE
= Gold flash on
contact,
= Bottom Entry
(Not available
with –TE)
SPECIFICATIONS
Matte Tin on tail
–TE
Insulator Material:
Black Liquid Crystal Polymer
Contact Material:
BeCu
–L
–A
= Through-hole
Top Entry
= 10 µ" (0.25 µm)
Gold on contact,
Matte Tin on tail
= Alignment Pin
(4 positions min.)
Metal or plastic at
Samtec discretion
(Not available with
-TE, -PE & -LC)
Plating:
–PE
Au or Sn over
= Through-hole
Pass-through
Entry
50 µ" (1.27 µm) Ni
Current Rating (HLE/TSM):
4.1 A per pin
(Requires –BE for
Bottom Entry)
–LC
(2 pins powered)
= Locking Clip
Voltage Rating:
400 VAC
No. of Positions x (2.54) .100
(2 positions min.)
(Not available with -A)
(Manual placement
required)
Operating Temp Range:
-55 °C to +125 °C
Insertion Depth:
(1.78 mm) .070" to
(3.43 mm) .135" pass-through,
or (2.59 mm) .102" min
plus board thickness for
bottom entry
(5.08)
.200
–K
= (6.50 mm)
.256" DIA
Polyimide Film
Pick & Place Pad
(3 positions min.)
Not available
with –TE or
(3.51)
.138
PROCESSING
–PE tail option
Lead–Free Solderable:
Yes
–P
SMT Lead Coplanarity:
(0.10 mm) .004" max (02-20)
(0.15 mm) .006" max (21-50)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
= Metal Pick
& Place Pad
(3 positions min.)
–TR
= Tape & Reel
(29 positions max.)
–FR
= Full Reel
Tape & Reel
(must order max.
quantity per reel;
contact Samtec for
quantity breaks)
—PE
ALSO AVAILABLE
Other Platings
(MOQ Required)
—TE
Note:
—P
Some lengths, styles and
options are non-standard,
non-returnable.
—LC
—A
F-221
samtec.com?HLE
Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice.