是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Obsolete | 零件包装代码: | DIP |
包装说明: | CERDIP-16 | 针数: | 16 |
Reach Compliance Code: | not_compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.5 |
Is Samacsys: | N | 模拟集成电路 - 其他类型: | SINGLE-ENDED MULTIPLEXER |
JESD-30 代码: | R-GDIP-T16 | JESD-609代码: | e0 |
湿度敏感等级: | 1 | 标称负供电电压 (Vsup): | -15 V |
信道数量: | 8 | 功能数量: | 1 |
端子数量: | 16 | 标称断态隔离度: | 68 dB |
最大通态电阻 (Ron): | 1500 Ω | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 封装主体材料: | CERAMIC, GLASS-SEALED |
封装代码: | DIP | 封装等效代码: | DIP16,.3 |
封装形状: | RECTANGULAR | 封装形式: | IN-LINE |
峰值回流温度(摄氏度): | 240 | 电源: | +-15 V |
认证状态: | Not Qualified | 座面最大高度: | 5.842 mm |
最大信号电流: | 0.02 A | 子类别: | Multiplexer or Switches |
最大供电电流 (Isup): | 2 mA | 最大供电电压 (Vsup): | 18 V |
最小供电电压 (Vsup): | 4.5 V | 标称供电电压 (Vsup): | 15 V |
表面贴装: | NO | 最长断开时间: | 500 ns |
最长接通时间: | 1000 ns | 切换: | BREAK-BEFORE-MAKE |
技术: | CMOS | 温度等级: | MILITARY |
端子面层: | Tin/Lead (Sn85Pb15) | 端子形式: | THROUGH-HOLE |
端子节距: | 2.54 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 20 | 宽度: | 7.62 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
DG509ACJ+ | MAXIM |
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