HI-1573, HI-1574
MIL-STD-1553
3.3V Monolithic Dual Transceivers
January 2007
DESCRIPTION
PIN CONFIGURATIONS
The HI-1573 and HI-1574 are low power CMOS dual
transceivers designed to meet the requirements of the
MIL-STD-1553 specification.
33
32
-
-
-
RXENA
GNDA
GNDA
GNDA
VDDB
VDDB
BUSB
BUSB
1
2
3
4
5
6
7
8
9
The transmitter section of each channel takes
complementary CMOS / TTL digital input data and
converts it to bi-phase Manchester encoded 1553 signals
suitable for driving the bus isolation transformer. Separate
transmitter inhibit control signals are provided for each
transmitter.
1573PCI
1573PCT
31 TXINHA
30 RXA
29 RXA
28
27
-
-
1574PCI
1574PCT
26 TXB
25 TXB
24 TXINHB
-
BUSB 10
BUSB 11
23
The receiver section of the each channel converts the 1553
bus bi-phase data to complementary CMOS / TTL data
suitable for inputting to a Manchester decoder. Each
receiver has a separate enable input which can be used to
force the output of the receiver to a logic "0" (HI-1573) or
logic 1 (HI-1574).
44 Pin Plastic 7mm x 7mm
Chip-scale package
To minimize the package size for this function, the
transmitter outputs are internally connected to the receiver
inputs, so that only two pins are required for connection to
each coupling transformer. For designs requiring
independent access to transmitter and receiver 1553
signals, please contact your Holt Sales representative.
VDDA 1
20 TXA
BUSA 2
BUSA 3
RXENA 4
GNDA 5
VDDB 6
BUSB 7
BUSB 8
RXENB 9
GNDB 10
19 TXA
1573PSI
1573PST
1573PSM
18 TXINHA
17 RXA
16 RXA
15 TXB
1574PSI
1574PST
1574PSM
FEATURES
14 TXB
13 TXINHB
12 RXB
11 RXB
!
Compliant to MIL-STD-1553A & B,
ARINC 708A
20 Pin Plastic ESOIC - WB package
!
!
3.3V single supply operation
VDDA
BUSA
BUSA
RXENA
GNDA
VDDB
BUSB
BUSB
RXENB
1
2
3
4
5
6
7
8
9
20 TXA
Smallest footprint available in 20 pin plastic
ESOIC (thermally enhanced SOIC) package
19 TXA
18 TXINHA
17 RXA
16 RXA
15 TXB
1573CDI
1573CDT
1573CDM
!
!
Less than 0.5W maximum power dissipation
7 mm x 7 mm 44-pin plastic chip-scale
package
1574CDI
1574CDT
1574CDM
14 TXB
!
Available in DIP and small outline (ESOIC)
package options
13 TXINHB
12 RXB
11 RXB
!
!
Military processing options
GNDB 10
Industry standard pin configurations
20 Pin Ceramic DIP package
HOLT INTEGRATED CIRCUITS
www.holtic.com
(DS1573 Rev.I)
01/07