Datasheet > HHM1711E2

HHM1711E2

更新时间： 2024-11-19 19:56:31

品牌	Logo	应用领域
东电化 - TDK		变压器
页数	文件大小	规格书
1页	47K
描述
RF Transformer, 2400MHz Min, 2500MHz Max, CHIP

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HHM1711E2 数据手册

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Product Name

Series

Part Number

Multilayer Chip Balun

HHM17 Series

HHM1711E2

Product Lifecycle Stage PROD

Specification

Summary/Applications/Feature

A balun is used as the impedance matching

Mounting Method Flag

Connection Type

Yes

Summary

element between two devices which have an

impedance mismatch.

surface_m

W-LAN,Bluetooth

Application System

Applications Mobile Phone, Wireless Lan..

Insertion Loss

Max

1 dB

Feature

Compact and high perfoamance

Min

2400 M Hz

2500 M Hz

Frequency Bandwidth

Packaging

Max

Nom

Min

Blister (Plastic)Taping

[180mm Reel]

Impedance iUnbalanced

50 Ohm

Packing

Impedance iBalanced

Return Loss

100 Ohm

10 dB

Minumum Package Qty Nom

4000 Pcs

Minimum Order Qty

Nom

Min

170 deg

190 deg

Phase

Imbalance iBalanced

Max

Amplitude

Imbalance iBalanced

Max

1.5 dB

Body Length(L)

Body Breadth(W)

Body Height(T)

Nom

Min

1.6 m m

0.8 m m

0.6 m m

-40 Cel

85 Cel

Category Temperature Range

Max

Min

-40 Cel

85 Cel

Storage Temperature Range

Weight

Max

Nom

0.0035 g

[ Caution ]

Specifications which provide more details for the proper

and safe use of the described product are available upon request.

[ Notice of Revision and Improve ]

All specifications are subject to change without notice.

http://roots.tdk.co.jp/rootsme.asp?ID=TJA743&NO=HHM1711E2&RT=1&DS... 3/27/2009

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