Nov 2009
BVDSS = 60 V
RDS(on) = 18 mΩ
HFW50N06 / HFI50N06
60V N-Channel MOSFET
ID = 50 A
D2-PAK I2-PAK
FEATURES
Originative New Design
HFW50N06
HFI50N06
Superior Avalanche Rugged Technology
Robust Gate Oxide Technology
Very Low Intrinsic Capacitances
Excellent Switching Characteristics
Unrivalled Gate Charge : 40 nC (Typ.)
Extended Safe Operating Area
Lower RDS(ON) : 0.018 Ω (Typ.) @VGS=10V
100% Avalanche Tested
1.Gate 2. Drain 3. Source
Absolute Maximum Ratings
TC=25℃ unless otherwise specified
Symbol
Parameter
Value
Units
V
VDSS
Drain-Source Voltage
Drain Current
60
50
ID
– Continuous (TC = 25℃)
– Continuous (TC = 100℃)
A
Drain Current
35.4
200
±25
490
50
A
IDM
Drain Current
– Pulsed
(Note 1)
A
VGS
EAS
IAR
Gate-Source Voltage
V
Single Pulsed Avalanche Energy
Avalanche Current
(Note 2)
(Note 1)
(Note 1)
(Note 3)
mJ
A
EAR
dv/dt
PD
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Power Dissipation (TA = 25℃)*
12
mJ
V/ns
7.0
3.75
120
W
W
Power Dissipation (TC = 25℃)
- Derate above 25℃
0.8
W/℃
℃
TJ, TSTG
TL
Operating and Storage Temperature Range
-55 to +175
Maximum lead temperature for soldering purposes,
1/8” from case for 5 seconds
300
℃
Thermal Resistance Characteristics
Symbol
Parameter
Typ.
Max.
Units
RθJC
Rθ JA
Junction-to-Case
--
--
--
1.24
Junction-to-Ambient*
Junction-to-Ambient
40
℃/W
62.5
RθJA
* When mounted on the minimum pad size recommended (PCB Mount)
◎ SEMIHOW REV.A0,Mar 2009