RoHS
HFC03SM High Frequency Chip Inductors
0.039±0.004
(1.0±0.10)
0.0197±0.004
(0.5±0.10)
Inches
(mm)
Dimensions:
0.010±0.004
0.0197±0.004
(0.25±0.10)
(0.50±0.10)
0.197
(0.50)
0.016
(0.40)
0.0177
(0.45)
0.512
(1.3)
Features
Allied
Part
Number
Inductance
Q
Min
DCR
Max.
(Ω)
IDC
Max.
(mA)
SRF
(MHz)Min
• 0402 EIA size for high board density
• Excellent Q and SRF characteristics
for high frequency applications.
Tolerance
(%)
(nh)
@100MHz,200mV
5
5
5
6000
6000
6000
6000
6000
0.10
0.10
0.10
0.12
0.15
0.15
1.5
1.6
1.8
2.0
2.2
2.4
2.7
8
8
8
8
8
8
• Cost effective monolithic construction
HFC03SM-1N5J-RC
HFC03SM-1N6J-RC
HFC03SM-1N8J-RC
HFC03SM-2N0J-RC
HFC03SM-2N2J-RC
400
400
400
400
Electrical
5
5
5
5
5
5
Inductance range: 1.5nh to 15nh
Tolerance: Available in: J=5%, S=+/-0.3nH,
C=+/-.2nH
Test Frequency: Inductance and Q
tested at 100MHz, 200mv with HP4291A
Impedance Analyzer
400
400
400
400
400
400
6000
6000
6000
6000
HFC03SM-2N4J-RC
HFC03SM-2N7J-RC
HFC03SM-3N0J-RC
HFC03SM-3N3J-RC
HFC03SM-3N6J-RC
8
8
8
0.15
0.15
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
0.15
Inductance vs Freq. Characteristics
measured on HP4291A
5
5
5
5
5
5
8
8
8
8
8
8
6000
6000
0.15
0.19
400
400
400
400
400
400
400
400
300
300
300
300
300
HFC03SM-3N9J-RC
HFC03SM-4N3J-RC
HFC03SM-4N7J-RC
HFC03SM-5N1J-RC
HFC03SM-5N6J-RC
Q vs Frequency Characteristics
measured on HP4291A
SRF measured on HPE4991 & HP87530
DCR measured on Chen Hwa CH502BC
or HP4338B
6000
6000
6000
0.20
0.20
0.20
5300
4300
0.20
0.25
5
5
5
5
5
5
5
5
6.2
6.8
7.5
8.2
9.1
10
HFC03SM-6N2J-RC
HFC03SM-6N8J-RC
HFC03SM-7N5J-RC
HFC03SM-8N2J-RC
HFC03SM-9N1J-RC
HFC03SM-10NJ-RC
HFC03SM-12NJ-RC
HFC03SM-15NS-RC
8
8
8
Mechanical
4200
3900
3600
3400
3200
2800
2300
0.25
0.25
0.30
0.34
0.35
0.35
0.46
Operating Temperature: -55ºC ~ 125ºC
Storage Temperature: -55ºC ~125ºC
(after PCB) Humidty 40% - 70% (before)
8
8
8
8
8
Solderability: 95% terminal coverage
Test Condition: Pre heat:150ºC. 1min.
Solder composition:
12
Sn/Ag3.0/Cu.0.5 (Pb free)
Solder temp: 245ºC±5ºC (pb Free)
Immersion time: 1=4± 1 sec.
15
Additional Inductance values available upon request.
All specifications subject to change without notice
Resistance to solder heat:
No damage to part
Test Condition
Pre heat: 150ºC. 1min.
Solder composition:
Sn/Ag3.0/Cu.0.5 (Pb free)
Solder temp: 260ºC±5ºC (pb Free)
Immersion time: 10 ± 1 sec.
Physical
Packaging: 10000 pieces per 7 inch reel.
.
www.alliedcomponents.com
949-356-1780
ALLIED COMPONENTS INTERNATIONAL
08/29/2014