Datasheet > HFC03SM

HFC03SM

更新时间： 2022-02-26 09:02:00

品牌	Logo	应用领域
ALLIED		/
页数	文件大小	规格书
1页	430K
描述
High Frequency Chip Inductors

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HFC03SM 数据手册

RoHS

HFC03SM High Frequency Chip Inductors

0.039±0.004

(1.0±0.10)

0.0197±0.004

(0.5±0.10)

Inches

(mm)

Dimensions:

0.010±0.004

0.0197±0.004

(0.25±0.10)

(0.50±0.10)

0.197

(0.50)

0.016

(0.40)

0.0177

(0.45)

0.512

(1.3)

Features

Allied

Part

Number

Inductance

Min

DCR

Max.

(Ω)

IDC

Max.

(mA)

SRF

(MHz)Min

• 0402 EIA size for high board density

• Excellent Q and SRF characteristics

for high frequency applications.

Tolerance

(%)

(nh)

@100MHz,200mV

6000

0.10

0.12

0.15

1.5

1.6

1.8

2.0

2.2

2.4

2.7

• Cost effective monolithic construction

HFC03SM-1N5J-RC

HFC03SM-1N6J-RC

HFC03SM-1N8J-RC

HFC03SM-2N0J-RC

HFC03SM-2N2J-RC

400

Electrical

Inductance range: 1.5nh to 15nh

Tolerance: Available in: J=5%, S=+/-0.3nH,

C=+/-.2nH

Test Frequency: Inductance and Q

tested at 100MHz, 200mv with HP4291A

Impedance Analyzer

400

6000

HFC03SM-2N4J-RC

HFC03SM-2N7J-RC

HFC03SM-3N0J-RC

HFC03SM-3N3J-RC

HFC03SM-3N6J-RC

0.15

3.0

3.3

3.6

3.9

4.3

4.7

5.1

5.6

0.15

Inductance vs Freq. Characteristics

measured on HP4291A

6000

0.15

0.19

400

300

HFC03SM-3N9J-RC

HFC03SM-4N3J-RC

HFC03SM-4N7J-RC

HFC03SM-5N1J-RC

HFC03SM-5N6J-RC

Q vs Frequency Characteristics

measured on HP4291A

SRF measured on HPE4991 & HP87530

DCR measured on Chen Hwa CH502BC

or HP4338B

6000

0.20

5300

4300

0.20

0.25

6.2

6.8

7.5

8.2

9.1

HFC03SM-6N2J-RC

HFC03SM-6N8J-RC

HFC03SM-7N5J-RC

HFC03SM-8N2J-RC

HFC03SM-9N1J-RC

HFC03SM-10NJ-RC

HFC03SM-12NJ-RC

HFC03SM-15NS-RC

Mechanical

4200

3900

3600

3400

3200

2800

2300

0.25

0.30

0.34

0.35

0.46

Operating Temperature: -55ºC ~ 125ºC

Storage Temperature: -55ºC ~125ºC

(after PCB) Humidty 40% - 70% (before)

Solderability: 95% terminal coverage

Test Condition: Pre heat:150ºC. 1min.

Solder composition:

Sn/Ag3.0/Cu.0.5 (Pb free)

Solder temp: 245ºC±5ºC (pb Free)

Immersion time: 1=4± 1 sec.

Additional Inductance values available upon request.

All specifications subject to change without notice

Resistance to solder heat:

No damage to part

Test Condition

Pre heat: 150ºC. 1min.

Solder composition:

Sn/Ag3.0/Cu.0.5 (Pb free)

Solder temp: 260ºC±5ºC (pb Free)

Immersion time: 10 ± 1 sec.

Physical

Packaging: 10000 pieces per 7 inch reel.

www.alliedcomponents.com

949-356-1780

ALLIED COMPONENTS INTERNATIONAL

08/29/2014

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