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HEF4094BT-Q100 PDF预览

HEF4094BT-Q100

更新时间: 2024-11-04 12:26:39
品牌 Logo 应用领域
恩智浦 - NXP 移位寄存器触发器逻辑集成电路光电二极管
页数 文件大小 规格书
2页 1889K
描述
NXP Logic – Q100 logic portfolio

HEF4094BT-Q100 技术参数

是否Rohs认证:符合生命周期:Transferred
零件包装代码:SOIC包装说明:3.90 MM, PLASTIC, MS-012, SOT109-1, SOP-16
针数:16Reach Compliance Code:unknown
HTS代码:8542.39.00.01风险等级:5.1
Is Samacsys:N计数方向:RIGHT
系列:4000/14000/40000JESD-30 代码:R-PDSO-G16
JESD-609代码:e4长度:9.9 mm
逻辑集成电路类型:SERIAL IN PARALLEL OUT湿度敏感等级:1
位数:8功能数量:1
端子数量:16最高工作温度:125 °C
最低工作温度:-40 °C输出特性:3-STATE
输出极性:TRUE封装主体材料:PLASTIC/EPOXY
封装代码:SOP封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
传播延迟(tpd):330 ns筛选级别:AEC-Q100
座面最大高度:1.75 mm最大供电电压 (Vsup):15 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:CMOS
温度等级:AUTOMOTIVE端子面层:NICKEL PALLADIUM GOLD
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:30
触发器类型:POSITIVE EDGE宽度:3.9 mm
最小 fmax:14 MHzBase Number Matches:1

HEF4094BT-Q100 数据手册

 浏览型号HEF4094BT-Q100的Datasheet PDF文件第2页 
Automotive  
Innovative package options  
Suffix  
BQ  
PW  
D
PW  
BQ  
PW  
GW  
GM  
SOT763-1  
16-pin  
SOT403-1  
16-pin  
SOT108-1  
14-pin  
SOT402-1  
14-pin  
SOT764-1  
20-pin  
SOT360-1  
20-pin  
SOT363  
6-pin  
SOT886  
6-pin  
Width (mm)  
Length (mm)  
Pitch (mm)  
2.50  
3.50  
0.50  
6.40  
5.00  
0.65  
6.00  
8.65  
1.27  
6.40  
5.00  
0.65  
2.50  
4.50  
0.50  
6.40  
6.50  
0.65  
2.10  
2.00  
0.65  
1.00  
1.45  
0.50  
Q100 Logic samples available in e-sample store. Order them today!  
Haven’t found your function? Please contact your local NXP representative.  
NXP Logic – Q100 logic portfolio  
Continuing to lead the way in automotive logic  
www.nxp.com  
© 2012 NXP Semiconductors N.V.  
All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the  
copyright owner. The information presented in this document does not form part of any quotation or contract,  
is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by  
the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under  
patent- or other industrial or intellectual property rights.  
Date of release: November 2012  
Document order number: 9397 750 17356  
Printed in the Netherlands  

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