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HCPL-T251-500 PDF预览

HCPL-T251-500

更新时间: 2024-09-22 11:03:47
品牌 Logo 应用领域
惠普 - HP 光电输出元件双极性晶体管栅极驱动
页数 文件大小 规格书
6页 175K
描述
0.4AMP OUTPUT CURRENT IGBT GATE DRIVE OPTOCOUPLER

HCPL-T251-500 数据手册

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0.4 Amp Output Current IGBT  
Gate Drive Optocoupler  
Technical Data  
HCPL-T251  
Features  
• Supply Current  
(I ): 11 mA (Max.)  
CC  
Description  
The HCPL-T251 contains GaAsP  
LED. The LED is optically  
Functional Diagram  
coupled to an integrated circuit  
with a power output stage. This  
optocoupler is ideally suited for  
driving power IGBTs and  
MOSFETs used in motor control  
inverter applications. The high  
operating voltage range of the  
output stage provides the drive  
voltages required by gate  
controlled devices. The voltage  
and current supplied by this  
optocoupler makes it ideally  
suited for directly driving small  
or medium power IGBTs.  
• Supply Voltage  
N/C  
ANODE  
CATHODE  
N/C  
1
8
V
V
V
V
CC  
(V ): 10-30 V  
CC  
• Output Current  
2
3
4
7
6
5
O
(I ): ± 0.4 A (Min.)  
O
O
• Switching Time  
(t  
/t  
): 1 µs (Max.)  
PLH PHL  
EE  
SHIELD  
• Isolation Voltage  
(V ): 3750 Vrms (Min.)  
ISO  
• UL 577 Recognized:  
File No. E55361  
• CSA Approved  
• 10 kV/µs Minimum Common  
Mode Rejection (CMR) at  
Vcm = 600 V  
Truth Table  
LED  
V
out  
OFF  
ON  
LOW  
HIGH  
Ordering Information  
Specify Part Number followed by  
Option Number.  
• Creepage Distance: 7.4 mm.  
Clearance: 7.1 mm.  
Applications  
• IGBT/MOSFET Gate Drive  
Example:  
• AC/Brushless DC Motor  
Drives  
• Industrial Inverters  
• Switch Mode Power  
Supplies  
HCPL-T251 #XXXX  
No Option = Standard DIP Package, 50 per tube.  
300 = Gull Wing Surface Mount Option,  
50 per tube.  
500 = Tape and Reel Packaging Option,  
1000 per reel.  
XXXE = Lead Free Option.  
Remarks: The notation “#” is used for existing products, while (new)  
products launched since 15th July 2001 and lead free option will use “-”  
A 0.1 µF bypass capacitor must be connected between pins 5 and 8.  
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component  
to prevent damage and/or degradation which may be induced by ESD.  

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