HCPL-181-00AE

更新时间： 2024-02-15 17:40:19

品牌	Logo	应用领域
安捷伦 - AGILENT		晶体光电晶体管光电晶体管
页数	文件大小	规格书
6页	74K
描述
Phototransistor Optocoupler SMD Mini-Flat Type

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中文翻译

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技术参数
数据手册

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HCPL-181-00AE 技术参数

是否Rohs认证：	符合	生命周期：	Active
Reach Compliance Code：	compliant	ECCN代码：	EAR99
HTS代码：	8541.40.80.00	风险等级：	1.25
JESD-609代码：	e3	端子面层：	Matte Tin (Sn)
Base Number Matches：	1

HCPL-181-00AE 数据手册

Agilent HCPL-181

Phototransistor Optocoupler

SMD Mini-Flat Type

Data Sheet

Features

•

Current Transfer Ratio

(CTR: min. 50% at I = 5 mA,

=5V)

•

High input-output isolation voltage

(V =3750Vrms)

iso

Description

Ordering Information

Specify part number followed by

Option Number (if desired).

The HCPL-181 contains a light

emitting diode optically coupled to

a phototransistor. It is packaged in

a 4-pin mini-flat SMD package with

a 2.0 mm profile. The small

dimension of this product allows

significant space saving. The

package volume is 30% smaller

than that of conventional DIP type.

Input-output isolation voltage is

High collector-emitter voltage (V

=80V)

CEO

HCPL-181-XXXE

Response time (t : typ., 4 µs at

= 2 V, I = 2 mA, R = 100 Ω)

C L

Lead Free

Option Number

Mini-flat package (2.0 mm profile) in

tape and reel package

•

UL approved

000 = No Options

060 = IEC/EN/DIN EN 60747-5-2

Option

00A = Rank Mark A

00B = Rank Mark B

00C = Rank Mark C

00D = Rank Mark D

CSA approved

IEC/EN/DINEN60747-5-2 approved

3750 Vrms. Response time, t , is

typically 4 µs and minimum CTR is

50% at input current of 5 mA.

Options available:

– IEC/EN/DINEN60747-5-2

approvals (060)

Applications

•

I/O interfaces for computers

System appliances, measuring in-

struments

Functional Diagram

PIN NO. AND INTERNAL

CONNECTION DIAGRAM

•

Signal transmission between cir-

cuits of different potentials and

impedances

Schematic

ANODE

COLLECTOR

EMITTER

Feedback circuit in power supply

–

CATHODE

1. ANODE

3. EMITTER

2. CATHODE 4. COLLECTOR

CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to

prevent damage and/or degradation which may be induced by ESD.

12 3 4 5 6

中文翻译

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