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HCC4011BF PDF预览

HCC4011BF

更新时间: 2024-11-03 22:56:59
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 栅极触发器逻辑集成电路
页数 文件大小 规格书
12页 289K
描述
NAND GATES

HCC4011BF 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:DIP
包装说明:DIP, DIP14,.3针数:14
Reach Compliance Code:not_compliantHTS代码:8542.39.00.01
风险等级:5.23Is Samacsys:N
系列:4000/14000/40000JESD-30 代码:R-GDIP-T14
JESD-609代码:e0长度:19.43 mm
负载电容(CL):50 pF逻辑集成电路类型:NAND GATE
功能数量:4输入次数:2
端子数量:14最高工作温度:125 °C
最低工作温度:-55 °C封装主体材料:CERAMIC, GLASS-SEALED
封装代码:DIP封装等效代码:DIP14,.3
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):NOT SPECIFIED电源:3/18 V
Prop。Delay @ Nom-Sup:250 ns传播延迟(tpd):250 ns
认证状态:Not Qualified施密特触发器:NO
座面最大高度:5.08 mm子类别:Gates
最大供电电压 (Vsup):18 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):5 V表面贴装:NO
技术:CMOS温度等级:MILITARY
端子面层:Tin/Lead (Sn/Pb)端子形式:THROUGH-HOLE
端子节距:2.54 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:7.62 mm
Base Number Matches:1

HCC4011BF 数据手册

 浏览型号HCC4011BF的Datasheet PDF文件第2页浏览型号HCC4011BF的Datasheet PDF文件第3页浏览型号HCC4011BF的Datasheet PDF文件第4页浏览型号HCC4011BF的Datasheet PDF文件第5页浏览型号HCC4011BF的Datasheet PDF文件第6页浏览型号HCC4011BF的Datasheet PDF文件第7页 
HCC4011B/12B/23B  
HCF4011B/12B/23B  
NAND GATES  
QUAD 2 INPUT HCC/HCF 4011B  
DUAL 4 INPUT HCC/HCF 4012B  
TRIPLE 3 INPUT HCC/HCF 4023B  
.
PROPAGATION DELAY TIME = 60ns (typ.) AT  
CL = 50pF, VDD = 10V  
BUFFERED INPUTS AND OUTPUTS  
QUIESCENT CURRENT SPECIFIED TO 20V  
FOR HCC DEVICE  
.
.
EY  
F
(Plastic Package)  
(Ceramic Frit Seal Package)  
.
INPUT CURRENT OF 100nA AT 18V AND 25°C  
FOR HCC DEVICE  
.
.
.
100% TESTED FOR QUIESCENT CURRENT  
5V, 10V AND 15V PARAMETRIC RATINGS  
MEETS ALLREQUIREMENTS OF JEDECTEN-  
TATIVE STANDARD No. 13A, ”STANDARD  
SPECIFICATIONS FOR DESCRIPTION OF ”B”  
SERIES CMOS DEVICES”  
M1  
C1  
(Micro Package)  
(Plastic Chip Carrier)  
ORDER CODES :  
HCC40XXBF  
HCF40XXBM1  
HCF40XXBEY  
HCF40XXBC1  
DESCRIPTION  
The HCC4011B, HCC4012B and HCC4023B (ex-  
tended temperature range) and HCF4011B,  
HCF4012B and HCF4023B (intermediate tempera-  
ture range) are monolithic, integrated circuit, avail-  
able in 14-lead dual in-line plastic or ceramic  
package and plastic micropackage.  
The HCC/HCF4011B, HCC/HCF4012B and  
HCC/HCF4023B NAND gates provide the system  
designer with direct implementation of the NAND  
function and supplement the existing family of  
COS/MOS gates. All inputs and outputs are buf-  
fered.  
PIN CONNECTIONS  
4011B  
4012B  
4023B  
June 1989  
1/12  

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