HBDM60V600W
Lead-free Green
COMPLEX TRANSISTOR ARRAY FOR BIPOLAR
TRANSISTOR HALF H-BRIDGE MOTOR/ACTUATOR DRIVER
Features
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Epitaxial Planar Die Construction
Lead Free By Design/RoHS Compliant (Note 1)
"Green" Device (Note 2)
6
5
4
Mechanical Data
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Case: SOT-363
1
2
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Case Material: Molded Plastic, “Green” Molding
3
Compound. UL Flammability Classification Rating 94V-0
Fig. 1: SOT-363
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Moisture Sensitivity: Level 1 per J-STD-020C
Terminal Connections: See Fig. 2
Terminals: Finish ¾ Matte Tin Finish annealed over Alloy
42 leadframe. Solderable per MIL-STD-202, Method 208
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Marking & Type Code Information: See Page 7
Ordering Information: See Page 7
CQ1
EQ1
EQ2
Weight: 0.016 grams (approximate)
Q1
MMBT2907A
Q2
MMBTA06
BQ1
BQ2
CQ2
Sub-Component
Reference
Device Type
Figure
P/N
Fig. 2: Schematic & Pin Configuration
MMBT2907A_DIE
MMBTA06_DIE
Q1
Q2
PNP Transistor
NPN Transistor
2
2
@ TA = 25°C unless otherwise specified
Maximum Ratings: Total Device
Characteristic
Symbol
Value
200
Unit
mW
°C/W
°C
Pd
Power Dissipation (Note 3)
R
qJA
625
Thermal Resistance, Junction to Ambient Air (Note 3)
Operating and Storage Junction Temperature Range
VEBO
-55 to +150
@ TA = 25°C unless otherwise specified
Maximum Ratings: Sub-Component Devices
Q1-PNP Transistor
(MMBT2907A)
Q2-NPN Transistor
Characteristic
Collector-Base Voltage
Symbol
Unit
(MMBTA06)
VCBO
VCEO
VEBO
IC
-60
-60
V
V
80
65
6
Collector-Emitter Voltage
V
Emitter-Base Voltage
-5.5
-600
Collector Current - Continuous (Note 3)
500
mA
Notes:
1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
3. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on page 8 or on Diodes Inc. suggested pad layout document
AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
DS30701 Rev. 2 - 2
1 of 8
HBDM60V600W
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ã Diodes Incorporated