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HBC25ZHN-T PDF预览

HBC25ZHN-T

更新时间: 2024-11-11 15:33:43
品牌 Logo 应用领域
BEL /
页数 文件大小 规格书
7页 433K
描述
DC-DC Regulated Power Supply Module, 1 Output, 300W, Hybrid

HBC25ZHN-T 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete包装说明:,
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8504.40.85.00风险等级:5.19
模拟集成电路 - 其他类型:DC-DC REGULATED POWER SUPPLY MODULE最大输入电压:75 V
最小输入电压:36 V标称输入电压:48 V
JESD-30 代码:R-XDMA-P9JESD-609代码:e0
最大负载调整率:1%功能数量:1
输出次数:1端子数量:9
最大输出电压:13.2 V最小输出电压:9.6 V
标称输出电压:12 V封装主体材料:UNSPECIFIED
封装形状:RECTANGULAR封装形式:MICROELECTRONIC ASSEMBLY
峰值回流温度(摄氏度):NOT SPECIFIED认证状态:Not Qualified
表面贴装:NO技术:HYBRID
端子面层:TIN LEAD端子形式:PIN/PEG
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
最大总功率输出:300 W微调/可调输出:YES
Base Number Matches:1

HBC25ZHN-T 数据手册

 浏览型号HBC25ZHN-T的Datasheet PDF文件第2页浏览型号HBC25ZHN-T的Datasheet PDF文件第3页浏览型号HBC25ZHN-T的Datasheet PDF文件第4页浏览型号HBC25ZHN-T的Datasheet PDF文件第5页浏览型号HBC25ZHN-T的Datasheet PDF文件第6页浏览型号HBC25ZHN-T的Datasheet PDF文件第7页 
HBC DC-DC Series Data Sheet  
300-Watt Half-Brick Converters  
Features  
High efficiency up to 94%  
High power density – 110 W/in3  
High current rating - 25A  
Low profile – 12.7mm height  
Input/output isolation: 1500VDC  
Basic insulation  
Start-up into high capacitive load  
Low conducted and radiated EMI  
Output overcurrent protection  
Output overvoltage protection  
Overtemperature protection  
Remote sense  
Applications  
Intermediate Bus architectures  
Remote on/off (primary referenced), positive  
or negative logic option  
Telecommunications equipment  
LAN/WAN applications  
Adjustable output voltage from 9.6V to 13.2V  
Data processing applications  
UL 1950 Recognition, CSA 22.2 No. 950-95  
certification, TUV IEC950  
Description  
The HBC Series of high density bus converters convert a worldwide telecom bus voltage of 36 to 75VDC to a  
12V bus at 25A. The output is ideal for powering nonisolated, point-of-load converters such as synchronous  
buck converters used commonly in intermediate bus architectures.  
The unit's open-frame, two-board construction provides ideal thermal transfer for maximum reliability. Power  
devices are mounted on an Insulated Metal Substrate (IMS) base plate with very low thermal impedance. The  
control PCB is physically isolated from the hotter IMS board, providing lower overall component temperatures for  
high reliability. The standard feature set includes remote on/off, remote output voltage sensing, positive output  
trim, input undervoltage lockout, and overtemperature shutdown with hysteresis.  
Model Selection  
Model  
Input  
Voltage  
VDC  
Input  
Current,  
Max  
Output  
Voltage  
Vout,  
Output rated  
Current  
I rated,  
Output  
Ripple/Noise,  
mV p-p  
Typical  
Efficiency @  
I rated,  
%
ADC  
VDC  
ADC  
HBC25ZH  
36-75  
10  
12.0  
25  
150  
92  
REV. JAN 17, 2005  
Page 1 of 7  
www.power-one.com  

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