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HB52E329EM-B6B PDF预览

HB52E329EM-B6B

更新时间: 2024-02-05 00:39:29
品牌 Logo 应用领域
尔必达 - ELPIDA 动态存储器
页数 文件大小 规格书
19页 143K
描述
256MB Unbuffered SDRAM DIMM

HB52E329EM-B6B 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:DIMM包装说明:DIMM, DIMM168
针数:168Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.36
风险等级:5.92访问模式:SINGLE BANK PAGE BURST
最长访问时间:6 ns其他特性:AUTO/SELF REFRESH
最大时钟频率 (fCLK):100 MHzI/O 类型:COMMON
JESD-30 代码:R-XDMA-N168内存密度:2415919104 bit
内存集成电路类型:SYNCHRONOUS DRAM MODULE内存宽度:72
湿度敏感等级:1功能数量:1
端口数量:1端子数量:168
字数:33554432 words字数代码:32000000
工作模式:SYNCHRONOUS最高工作温度:65 °C
最低工作温度:组织:32MX72
输出特性:3-STATE封装主体材料:UNSPECIFIED
封装代码:DIMM封装等效代码:DIMM168
封装形状:RECTANGULAR封装形式:MICROELECTRONIC ASSEMBLY
峰值回流温度(摄氏度):225电源:3.3 V
认证状态:Not Qualified刷新周期:8192
自我刷新:YES最大待机电流:0.018 A
子类别:DRAMs最大压摆率:1.98 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):3.3 V表面贴装:NO
技术:CMOS温度等级:COMMERCIAL
端子形式:NO LEAD端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

HB52E329EM-B6B 数据手册

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DATA SHEET  
256MB Unbuffered SDRAM DIMM  
HB52E328EM-A6B, -B6B (32M words × 64 bits, 1 bank)  
HB52E329EM-A6B, -B6B (32M words × 72 bits, 1 bank)  
Byte control by DQMB  
Description  
Refresh cycles: 8192 refresh cycles/64ms  
2 variations of refresh  
Auto refresh  
The HB52E328EM and HB52E329EM belong to 8-byte  
DIMM (Dual In-line Memory Module) family, and have  
been developed as an optimized main memory solution  
Self refresh  
for 8-byte processor applications.  
They are  
synchronous Dynamic RAM Module, mounted 256M  
bits SDRAMs (HM5225805BTT) sealed in TSOP  
package, and 1 piece of serial EEPROM (2k bits) for  
Presence Detect (PD).  
The HB52E328EM is  
organized 32M × 64 × 1 bank mounted 8 pieces of  
256M bits SDRAM. The HB52E329EM is organized  
32M × 72 × 1 bank mounted 9 pieces of 256M bits  
SDRAM.  
Therefore, they make high density mounting possible  
without surface mount technology.  
common data inputs and outputs.  
They provide  
Decoupling  
capacitors are mounted beside each TSOP on the  
module board.  
Features  
Fully compatible with: JEDEC standard outline 8-  
byte DIMM  
168-pin socket type package (dual lead out)  
Outline: 133.37mm (Length) × 34.925mm (Height)  
× 4.00mm (Thickness)  
Lead pitch: 1.27mm  
3.3V power supply  
Clock frequency: 100MHz (max.)  
LVTTL interface  
Data bus width : × 64 Non parity (HB52E328EM)  
: × 72 ECC (HB52E329EM)  
Single pulsed /RAS  
4 Banks can operates simultaneously and  
independently  
Burst read/write operation and burst read/single write  
operation capability  
Programmable burst length (BL): 1, 2, 4, 8  
2 variations of burst sequence  
Sequential  
Interleave  
Programmable /CE latency (CL)  
: 2, 3 (HB52E328EM/329EM-A6B)  
: 3 (HB52E328EM/329EM-B6B)  
Document No. E0185H10 (Ver. 1.0)  
Date Published July 2001  
Printed in Japan  
URL: http://www.elpida.com  
C
Elpida Memory, Inc. 2001  
Elpida Memory, Inc. is a joint venture DRAM company of NEC Corporation and Hitachi, Ltd.  

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