HAT2010F
Silicon N Channel Power MOS FET
SOP–8
Application
Power switching
5
6
7
8
Features
4
3
2
• Low on–resistance
• Capable of 4V gate drive
• Low drive current
6
D D
5
7 8
D D
1
• High density mounting
4
G
2
G
Ordering Information
1, 3
2, 4
Source
Gate
————————————————————
5, 6, 7, 8 Drain
S 3
1
S
Hitachi Code
FP–8D
MOS2
MOS1
————————————————————
EIAJ Code
SC–527–8A
————————————————————
JEDEC Code
—
————————————————————
Table 1 Absolute Maximum Ratings (Ta = 25°C)
Item
Symbol
Ratings
Unit
———————————————————————————————————————————
Drain to source voltage
V
30
V
DSS
———————————————————————————————————————————
Gate to source voltage
V
±20
V
GSS
———————————————————————————————————————————
Drain current
I
3.5
A
D
———————————————————————————————————————————
Drain peak current
I
*
14
A
D(pulse)
———————————————————————————————————————————
Channel dissipation
Pch***
1.5
W
———————————————————————————————————————————
Channel dissipation
Pch**
1
W
———————————————————————————————————————————
Channel temperature
Tch
150
°C
———————————————————————————————————————————
Storage temperature
Tstg
–55 to +150
°C
———————————————————————————————————————————
PW ≤ 10 µs, duty cycle ≤ 1 %
*
** 1 Drive operation
*** 2 Drive operation
When using the glass epoxy board (40 x 40 x 1.6 mm)
When using the glass epoxy board (40 x 40 x 1.6 mm)