Spec. No. : MOS200902
Issued Date : 2009.03.24
Revised Date :2009.08.05
Page No. : 1/6
HI-SINCERITY
MICROELECTRONICS CORP.
H12N65 Series
H12N65 Series
Tab
3-Lead Plastic TO-220AB
Package Code: E
Pin 1: Gate
N-Channel Power MOSFET (650V,12A)
Pin 2 & Tab: Drain
Pin 3: Source
Applications
3
• Switch Mode Power Supply
• Uninterruptable Power Supply
• High Speed Power Switching
2
1
3-Lead TO-220FP)
Plastic Package
Package Code: F
Pin 1: Gate
Pin 2: Drain
Pin 3: Source
Features
3
• H12N65 Series is a High voltage NChannel enhancement mode power MOSFET
chip fabricated in advanced silicon epitaxial planar technology
• Advanced termination scheme to provide enhanced voltageblocking capability
• Avalanche Energy Specified
2
1
H12N65F Series Symbol
D
• Source to Drain Diode Recovery Time Comparable to a Discrete Fast Recovery Diode;
• The packaged product is widely used in AC-DC power suppliers, DCDC converters and
Hbridge PWM motor drivers
G
S
Absolute Maximum Ratings
Symbol
VDSS
ID
Parameter
Value
Units
V
Drain-Source Voltage
650
12
Drain Current (VGS@10V, TC=25oC)
Gate-to-Source Voltage
A
VGS
V
±30
TO-220AB
TO-220FP
TO-220AB
TO-220FP
175
Total Power Dissipation (TC=25oC)
W
50
PD
1.43
W/°C
0.41
Linear Derating Factor
EAS
IAR
Single Pulse Avalanche Energy*2
Avalanche Current*1
990
12
mJ
A
EAR
TJ
Repetitive Avalanche Energy*1
Operating Junction Temperature Range
Storage Temperature Range
22
mJ
-55 to 150
-55 to 150
°C
°C
Tstg
*1: Repetitive rating; pulse width limited by max. junction temperature
*2: Starting TJ=25°C, L=1.2mH, RG=25Ω, IAS=10A
*3: ISD≤14A, di/dt≤130A/us, VDD≤V(BR)DSS, TJ≤150°C
Thermal Characteristics
Symbol
Parameter
Value
Units
°C/W
°C/W
TO-220AB
TO-220FP
1.3
5
Thermal Resistance Junction to Case (Max.)
Thermal Resistance Junction to Ambient (Max.)
RθJC
62
RθJA
H10N65 Series
HSMC Product Specification