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H02N60E PDF预览

H02N60E

更新时间: 2024-11-25 21:54:35
品牌 Logo 应用领域
HSMC 晶体晶体管功率场效应晶体管
页数 文件大小 规格书
6页 78K
描述
N-Channel Power Field Effect Transistor

H02N60E 技术参数

生命周期:Obsolete包装说明:,
Reach Compliance Code:unknown风险等级:5.84
Is Samacsys:NBase Number Matches:1

H02N60E 数据手册

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Spec. No. : MOS200403  
Issued Date : 2004.07.01  
Revised Date : 2005.07.14  
Page No. : 1/6  
HI-SINCERITY  
MICROELECTRONICS CORP.  
H02N60 Series Pin Assignment  
H02N60 Series  
3-Lead Plastic TO-252  
Tab  
Package Code: J  
Pin 1: Gate  
N-Channel Power Field Effect Transistor  
3
Pin 2 & Tab: Drain  
Pin 3: Source  
2
1
Tab  
3-Lead Plastic TO-251  
Package Code: I  
Pin 1: Gate  
Description  
This high voltage MOSFET uses an advanced termination scheme to  
provide enhanced voltage-blocking capability without degratding  
performance over time. In addition, this advanced MOSFET is designed to  
withstand high energy in avalanche and commutation modes. The new  
energy efficient design also offers a drain-to-source diode with a fast  
recovery time. Designed for high voltage, high speed switching  
applications in power supplies, converters and PWM motor controls,  
these devices are particularly well suited for bridge circuits where diode  
speed and commutating safe operating areas are critical and offer  
additional and saafety margin against unexpected voltage transients.  
Pin 2 & Tab: Drain  
Pin 3: Source  
3
2
1
Tab  
3-Lead Plastic TO-220AB  
Package Code: E  
Pin 1: Gate  
Pin 2 & Tab: Drain  
Pin 3: Source  
3
2
1
3-Lead Plastic TO-220FP  
Package Code: F  
Pin 1: Gate  
Pin 2: Drain  
Pin 3: Source  
Features  
Robust High Voltage Termination  
Avalanc he Energy Specified  
Source-to-Drain Diode Recovery Time Comparable to a Discrete Fast  
Recovery Diode  
3
2
D
1
Diode is Characterized for Use in Bridge Circuits  
IDSS and VDS(on) Specified at Elevated Temperature  
H02N60 Series  
Symbol:  
G
S
Absolute Maximum Ratings  
Symbol  
ID  
Parameter  
Drain to Current (Continuous)  
Value  
2
Units  
A
IDM  
Drain to Current (Pulsed)  
8
A
VGS  
Gate-to-Source Voltage (Continue)  
Total Power Dissipation (TC=25oC)  
H02N60I (TO-251) / H02N60J (TO-252)  
H02N60E (TO-220AB)  
V
±20  
50  
50  
25  
W
H02N60F (TO-220FP)  
PD  
Derate above 25°C  
0.4  
0.4  
H02N60I (TO-251) / H02N60J (TO-252)  
H02N60E (TO-220AB)  
W/°C  
0.33  
H02N60F (TO-220FP)  
Tj, Tstg  
EAS  
Operating and Storage Temperature Range  
-55 to 150  
°C  
Single Pulse Drain-to-Source Avalanche Enrgy-Tj=25°C  
(VDD=100V, VGS=10V, IL=2A, L=10mH, RG=25)  
35  
mJ  
Maximum Lead Temperature for Soldering Purposes, 1/8”  
from case for 10 seconds  
TL  
260  
°C  
H02N60I, H02N60J, H02N60E, H02N60F  
HSMC Product Specification  

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