Spec. No. : MOS200501
Issued Date : 2005.01.01
Revised Date : 2005.09.28
Page No. : 1/5
HI-SINCERITY
MICROELECTRONICS CORP.
H01N60S Series Pin Assignment
H01N60S Series
N-Channel Power Field Effect Transistor
Tab
3-Lead Plastic TO-252
Package Code: J
Pin 1: Gate
Pin 2 & Tab: Drain
3
2
Description
1
Pin 3: Source
This high voltage MOSFET uses an advanced termination scheme to
provide enhanced voltage-blocking capability without degratding
performance over time. In addition, this advanced MOSFET is designed to
withstand high energy in avalanche and commutation modes. The new
energy efficient design also offers a drain-to-source diode with a fast
recovery time. Designed for high voltage, high speed switching
applications in power supplies, converters and PWM motor controls,
these devices are particularly well suited for bridge circuits where diode
speed and commutating safe operating areas are critical and offer
additional and saafety margin against unexpected voltage transients.
Tab
3-Lead Plastic TO-251
Package Code: I
Pin 1: Gate
Pin 2 & Tab: Drain
Pin 3: Source
3
2
1
D
H01N60S Series
Symbol:
G
Features
S
• 1A, 600V, RDS(on)=12Ω@VGS=10V
• Low Gate Charge 15nC(Typ.)
• Low Crss 4pF(Typ.)
• Fast Switching
• Improved dv/dt Capability
Absolute Maximum Ratings
Symbol
VDSS
Parameter
H01N60SI / H01N60SJ
Units
V
Drain-Source Voltage
600
1
Drain Current (Continuous TC=25oC)
Drain Current (Continuous TC=100oC)
Drain Current (Pulsed) *1
A
ID
0.6
4
A
IDM
A
VGS
Gate-Source Voltage
V
±30
Single Pulse Avalanche Energy
(L=59mH, IAS=1.1A, VDD=50V, RG=25Ω, Starting TJ=25°C)
EAS
50
mJ
IAR
EAR
Avalanche Current *1
1
2.8
A
mJ
V/nS
V
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt *2
Gate-to-Source Voltage (Continue)
Total Power Dissipation (TA=25oC)
Total Power Dissipation (TC=25oC)
Derate above 25°C
dv/dt
VGS
4.5
±20
2.5
W
28
W
PD
0.22
-55 to +150
W/°C
°C
Tj, Tstg
TL
Operating and Storage Temperature Range
Maximum Lead Temperature for Soldering Purposes, 1/8”
from case for 5 seconds
300
°C
*1: Repetitive Rating : Pulse width limited by maximum junction temperature
*2: ISD≤1.1A, di/dt≤200A/us, VDD≤BVDSS, Starting TJ=25oC
H01N60SI, H01N60SJ
HSMC Product Specification