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GWM120-0075P3-SMD PDF预览

GWM120-0075P3-SMD

更新时间: 2024-11-20 07:55:19
品牌 Logo 应用领域
IXYS 开关光电二极管晶体管
页数 文件大小 规格书
6页 208K
描述
Power Field-Effect Transistor, 118A I(D), 75V, 0.0055ohm, 6-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET

GWM120-0075P3-SMD 技术参数

生命周期:Obsolete包装说明:SMALL OUTLINE, R-PDSO-G17
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:5.83外壳连接:ISOLATED
配置:BRIDGE, 6 ELEMENTS WITH BUILT-IN DIODE最小漏源击穿电压:75 V
最大漏极电流 (ID):118 A最大漏源导通电阻:0.0055 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PDSO-G17
元件数量:6端子数量:17
工作模式:ENHANCEMENT MODE封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
极性/信道类型:N-CHANNEL认证状态:Not Qualified
表面贴装:YES端子形式:GULL WING
端子位置:DUAL晶体管应用:SWITCHING
晶体管元件材料:SILICON

GWM120-0075P3-SMD 数据手册

 浏览型号GWM120-0075P3-SMD的Datasheet PDF文件第2页浏览型号GWM120-0075P3-SMD的Datasheet PDF文件第3页浏览型号GWM120-0075P3-SMD的Datasheet PDF文件第4页浏览型号GWM120-0075P3-SMD的Datasheet PDF文件第5页浏览型号GWM120-0075P3-SMD的Datasheet PDF文件第6页 
GWM 120-0075P3  
VDSS  
ID25  
= 75 V  
= 118 A  
Three phase full Bridge  
with Trench MOSFETs  
in DCB isolated high current package  
RDSon typ. = 3.7 mW  
L+  
G3  
G5  
S5  
G1  
S1  
S3  
L1  
L2  
L3  
Surface Mount  
Device  
Bent leads  
G4  
S4  
G6  
S6  
G2  
S2  
L-  
Straight leads  
Applications  
MOSFETs  
Symbol  
VDSS  
AC drives  
Conditions  
Maximum Ratings  
• in automobiles  
- electric power steering  
- starter generator  
• in industrial vehicles  
- propulsion drives  
- fork lift drives  
TVJ = 25°C to 150°C  
75  
20  
V
±
VGS  
V
ID25  
ID90  
TC = 25°C  
TC = 90°C  
118  
85  
A
A
• in battery supplied equipment  
IF25  
IF90  
TC = 25°C (diode)  
TC = 90°C (diode)  
120  
78  
A
A
Features  
• MOSFETs in trench technology:  
- low RDSon  
- optimized intrinsic reverse diode  
• package:  
Symbol  
Conditions  
Characteristic Values  
(TVJ = 25°C, unless otherwise specified)  
min. typ. max.  
- high level of integration  
- high current capability 300 A max.  
- aux. terminals for MOSFET control  
- terminals for soldering or welding  
connections  
- isolated DCB ceramic base plate  
with optimized heat transfer  
• Space and weight savings  
RDSon  
on chip level at  
TVJ = 25°C  
TVJ = 125°C  
3.7  
8.4  
5.5  
mW  
mW  
VGS = 10 V; ID = 60 A  
VGS(th)  
IDSS  
VDS = 20 V; ID = 1 mA  
VDS = VDSS; VGS = 0 V  
2
4
1
V
TVJ = 25°C  
TVJ = 125°C  
µA  
mA  
0.1  
±
IGSS  
VGS  
=
20 V; VDS = 0 V  
0.2  
µA  
Qg  
Qgs  
Qgd  
100  
19  
28  
nC  
nC  
nC  
Package options  
VGS = 10 V; VDS = 55 V; ID = 125 A  
• 3 lead forms available  
- straight leads (SL)  
- SMD lead version (SMD)  
- bent leads (BL)  
td(on)  
tr  
td(off)  
tf  
80  
80  
510  
100  
ns  
ns  
ns  
ns  
VGS = 10 V; VDS = 30 V  
ID = 80 A; RG = 39 Ω  
inductive load  
Eon  
Eoff  
Erecoff  
0.12  
0.40  
0.02  
mJ  
mJ  
mJ  
RthJC  
RthJH  
1.0 K/W  
1.6 K/W  
with heat transfer paste (IXYS test setup)  
1.3  
IXYS reserves the right to change limits, test conditions and dimensions.  
© 2008 IXYS All rights reserved  
20081126f  
1 - 6  

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