是否无铅: | 含铅 | 是否Rohs认证: | 符合 |
生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | BGA, BGA544,26X26,50 | 针数: | 544 |
Reach Compliance Code: | compliant | ECCN代码: | 3A001.A.3 |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.84 |
边界扫描: | YES | 最大时钟频率: | 66 MHz |
格式: | FIXED POINT | 集成缓存: | YES |
JESD-30 代码: | S-PBGA-B544 | JESD-609代码: | e0 |
长度: | 35 mm | 低功率模式: | NO |
端子数量: | 544 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | BGA | 封装等效代码: | BGA544,26X26,50 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, HEAT SINK/SLUG |
峰值回流温度(摄氏度): | NOT SPECIFIED | 电源: | 1.4,3.3 V |
认证状态: | Not Qualified | 座面最大高度: | 2.51 mm |
速度: | 667 MHz | 子类别: | Microprocessors |
最大供电电压: | 1.47 V | 最小供电电压: | 1.33 V |
标称供电电压: | 1.4 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子形式: | BALL | 端子节距: | 1.27 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 35 mm | uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC |
Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
GWIXP460BAD | INTEL | RISC Microprocessor, 32-Bit, 533MHz, CMOS, PBGA544, PLASTIC, BGA-544 |
获取价格 |
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GWIXP460BADT | INTEL | RISC Microprocessor, 32-Bit, 533MHz, CMOS, PBGA544, PLASTIC, BGA-544 |
获取价格 |
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GWIXP465AAB | INTEL | RISC Microprocessor, 266MHz, CMOS, PBGA544, PLASTIC, BGA-544 |
获取价格 |
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GWIXP465AABT | INTEL | RISC Microprocessor, 266MHz, CMOS, PBGA544, PLASTIC, BGA-544 |
获取价格 |
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GWIXP465AAC | INTEL | RISC Microprocessor, 400MHz, CMOS, PBGA544, PLASTIC, BGA-544 |
获取价格 |
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GWIXP465AAD | INTEL | RISC Microprocessor, 533MHz, CMOS, PBGA544, PLASTIC, BGA-544 |
获取价格 |