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GVT71256E18B-9 PDF预览

GVT71256E18B-9

更新时间: 2024-10-30 05:54:31
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器
页数 文件大小 规格书
16页 281K
描述
Standard SRAM, 256KX18, 8.5ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119

GVT71256E18B-9 数据手册

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325A  
CY7C1325A/GVT71256E18  
256K x 18 Synchronous Flow-Through Burst SRAM  
The  
CY7C1325A/GVT71256E18  
SRAM  
integrates  
Features  
262,144x18 SRAM cells with advanced synchronous periph-  
eral circuitry and a 2-bit counter for internal burst operation. All  
synchronous inputs are gated by registers controlled by a pos-  
itive-edge-triggered Clock Input (CLK). The synchronous in-  
puts include all addresses, all data inputs, address-pipelining  
Chip Enable (CE), depth-expansion Chip Enables (CE2 and  
CE2), Burst Control inputs (ADSC, ADSP, and ADV), Write  
Enables (WEL, WEH, and BWE), and Global Write (GW).  
• Fast access times: 7.5 and 8 ns  
• Fast clock speed: 117 and 100 MHz  
• Provide high-performance 2-1-1-1 access rate  
• Fast OE access times: 4.0 ns  
• 3.3V –5% and +10% power supply  
• 2.5V or 3.3V I/O supply  
• 5V tolerant inputs except I/Os  
Asynchronous inputs include the Output Enable (OE) and  
Burst Mode Control (MODE), and Sleep Mode Control (ZZ).  
The data outputs (DQ), enabled by OE, are also asynchro-  
nous.  
• Clamp diodes to VSSQ at all inputs and outputs  
• Common data inputs and data outputs  
• Byte Write Enable and Global Write control  
Addresses and chip enables are registered with either Ad-  
dress Status Processor (ADSP) or Address Status Controller  
(ADSC) input pins. Subsequent burst addresses can be inter-  
nally generated as controlled by the Burst Advance pin (ADV).  
• Three chip enables for depth expansion and address  
pipeline  
• Address, data and control registers  
• Internally self-timed Write Cycle  
Address, data inputs, and write controls are registered on-chip  
to initiate a self-timed Write cycle. Write cycles can be one to  
four bytes wide as controlled by the write control inputs. Indi-  
vidual byte write allows individual byte to be written. WEL con-  
trols DQ1DQ8 and DQP1. WEH controls DQ9DQ16 and  
DQP2. WEL and WEH can be active only with BWE being  
LOW. GW being LOW causes all bytes to be written.  
• Burst control pins (interleaved or linear burst se-  
quence)  
• Automatic power-down for portable applications  
• Low profile 119-lead, 14-mm x 22-mm BGA (Ball Grid  
Array) and 100-pin TQFP packages  
Functional Description  
The CY7C1325A/GVT71256E18 operates from a +3.3V pow-  
er supply and all outputs operate on a +2.5V supply. All inputs  
and outputs are JEDEC standard JESD8-5 compatible. The  
device is ideally suited for 486, Pentium®, 680x0, and Power-  
PCsystems and for systems that benefit from a wide syn-  
chronous data bus.  
The Cypress Synchronous Burst SRAM family employs high-  
speed, low-power CMOS designs using advanced triple-layer  
polysilicon, double-layer metal technology. Each memory cell  
consists of four transistors and two high-valued resistors.  
Selection Guide  
7C1325A-117  
71256E18-7  
7C1325A-100  
71256E18-8  
7C1325A-100  
71256E18-9  
7C1325A-100  
71256E18-10  
Maximum Access Time (ns)  
7.5  
370  
10  
8
8
8
Maximum Operating Current (mA)  
Maximum CMOS Standby Current (mA)  
320  
10  
320  
10  
320  
10  
Cypress Semiconductor Corporation  
Document #: 38-05118 Rev. *A  
3901 North First Street  
San Jose  
CA 95134  
408-943-2600  
Revised November 12, 2002  

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