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GVT1256DA18B-6 PDF预览

GVT1256DA18B-6

更新时间: 2024-10-28 23:54:15
品牌 Logo 应用领域
其他 - ETC 静态存储器
页数 文件大小 规格书
24页 294K
描述
x18 Fast Synchronous SRAM

GVT1256DA18B-6 数据手册

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CY7C1347C/GVT71128DA36  
CY7C1327C/GVT71256DA18  
256K x 18/128K x 36 Synchronous-Pipelined  
Cache RAM  
The CY7C1347C/GVT71128DA36 and CYC7C1327C/  
GVT71256DA18 SRAMs integrate 131,072x36 and  
262,144x18 SRAM cells with advanced synchronous periph-  
Features  
• Fast access times: 2.5 and 3.5 ns  
eral circuitry and a 2-bit counter for internal burst operation. All  
synchronous inputs are gated by registers controlled by a pos-  
itive-edge-triggered clock input (CLK). The synchronous in-  
puts include all addresses, all data inputs, address-pipelining  
Chip Enable (CE), depth-expansion Chip Enables (CE2 and  
CE2), Burst Control Inputs (ADSC, ADSP, and ADV), Write  
Enables (BWa, BWb, BWc, BWd, and BWE), and Global Write  
(GW).  
• Fast clock speed: 250, 225, 200, and 166 MHz  
• 1-ns set-up time and hold time  
• Fast OE access times: 2.5 ns and 3.5 ns  
• Optimal for depth expansion (one cycle chip deselect  
to eliminate bus contention)  
• 3.3V –5% and +10% power supply  
• 3.3V or 2.5V I/O supply  
• 5V tolerant inputs except I/Os  
Asynchronous inputs include the Output Enable (OE) and  
Burst Mode Control (MODE). The data outputs (Q), enabled  
by OE, are also asynchronous.  
• Clamp diodes to V at all inputs and outputs  
SS  
• Common data inputs and data outputs  
Addresses and chip enables are registered with either Ad-  
dress Status Processor (ADSP) or Address Status Controller  
(ADSC) input pins. Subsequent burst addresses can be inter-  
nally generated as controlled by the Burst Advance pin (ADV).  
• Byte Write Enable and Global Write control  
• Three chip enables for depth expansion and address  
pipeline  
• Address, data, and control registers  
• Internally self-timed Write Cycle  
• Burst control pins (interleaved or linear burst se-  
quence)  
• Automatic power-down for portable applications  
• JTAG boundary scan  
• JEDEC standard pinout  
• Low profile 119-lead, 14-mm x 22-mm BGA (Ball Grid  
Array) and 100-pin TQFP packages  
Address, data inputs, and write controls are registered on-chip  
to initiate self-timed Write cycle. Write cycles can be one to  
four bytes wide as controlled by the write control inputs. Indi-  
vidual byte write allows individual byte to be written. BWa con-  
trols DQa. BWb controls DQb. BWc controls DQc. BWd con-  
trols DQd. BWa, BWb, BWc, and BWd can be active only with  
BWE being LOW. GW being LOW causes all bytes to be writ-  
ten. The x18 version only has 18 data inputs/outputs (DQa and  
DQb) along with BWa and BWb (no BWc, BWd, DQc, and  
DQd).  
Functional Description  
Four pins are used to implement JTAG test capabilities: Test  
Mode Select (TMS), Test Data-in (TDI), Test Clock (TCK), and  
Test Data-out (TDO). The JTAG circuitry is used to serially shift  
data to and from the device. JTAG inputs use LVTTL/LVCMOS  
levels to shift data during this testing mode of operation.  
The Cypress Synchronous Burst SRAM family employs  
high-speed, low-power CMOS designs using advanced tri-  
ple-layer polysilicon, double-layer metal technology. Each  
memory cell consists of four transistors and two high-valued  
resistors.  
The  
CY7C1347C/GVT71128DA36  
and  
CY7C1327C/  
GVT71256DA18 operate from a +3.3V power supply. All inputs  
and outputs are LVTTL compatible  
Selection Guide  
7C1347C-250  
7C1347C-225  
71128DA36-4.4  
7C1327C-225  
71256DA18-4.4  
7C1347C-200  
71128DA36-5  
7C1327C-200  
71256DA18-5  
7C1347C-166  
71128DA36-6  
7C1327C-166  
71256DA18-6  
71128DA36-4  
7C1327C-250  
71256DA18-4  
Maximum Access Time (ns)  
2.5  
450  
10  
2.5  
400  
10  
2.5  
360  
10  
3.5  
300  
10  
Maximum Operating Current (mA)  
Maximum CMOS Standby Current (mA)  
Cypress Semiconductor Corporation  
3901 North First Street  
San Jose  
CA 95134  
408-943-2600  
July 21, 2000  

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