ISSUED DATE :2006/12/12
REVISED DATE :
GTM
CORPORATION
GDBAS16
S U R F A C E M O U N T, S W I T C H I N G D I O D E
V O LT AG E 8 5 V, C U R R E N T 2 5 0 m A
Description
The GDBAS16 is designed for high-speed switching application in hybrid thick and thin-film circuits.
The devices is manufactured by the silicon epitaxial planar process and packed in a plastic surface mount
package.
Package Dimensions
Millimeter
Millimeter
REF.
REF.
Min.
Max.
1.05
0.10
1.00
1.45
1.80
2.70
Min.
Max.
A
A1
A2
D
E
HE
0.85
0
L
b
c
0.20
0.25
0.10
0.40
0.40
0.18
0.80
1.15
1.60
2.30
Q1
0.15 BSC.
Absolute Maximum Ratings at T
Parameter
A = 25к
Symbol
Tj
Ratings
+150
-65 ~ +150
85
Unit
к
Junction Temperature
Storage Temperature
Tstg
к
Reverse Voltage
VR
V
Repetitive Reverse Voltage
Forward Current
V
RRM
85
V
IO
250
mA
mA
mA
mW
Repetitive Forward Current
Forward Surge Current (1ms)
Total Power Dissipation
I
FM
500
IFSM
1000
225
P
D
Electrical Characteristics (at T
A
= 25к unless otherwise noted)
Characteristic
Symbol
Min.
Max.
Unit
Test Conditions
Reverse Breakdown Voltage
V(BR
)
85
-
-
V
I
I
I
I
I
R
=100uA
VF
VF
VF
VF
(1)
715
855
1000
1250
1
mV
mV
mV
mV
uA
F
F
F
F
=1mA
(2)
(3)
(4)
-
=10mA
=50mA
=150mA
Forward Voltage
-
-
Reverse Current
IR
-
V
R
=85V
Total Capacitance
Reverse Recovery Time
C
T
2
pF
V
R
=0, f=1MHz
Trr
-
6
nS
IF=IR=10mA, RL=100ꢀ measured at IR=1mA
GDBAS16
Page: 1/2