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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| GT9 RID8x14x15H5T(Balun) | TDK |
获取价格 |
Balun Cores(RID/Double-Aperture) |
|
| GT9 RID8x14x15H5T(EMC) | TDK |
获取价格 |
EMC Suppression(RID/Double-Aperture) |
|
| GT9 RID8x7x15H5(Balun) | TDK |
获取价格 |
Balun Cores(RID/Double-Aperture) |
|
| GT9 RID8x7x15H5(EMC) | TDK |
获取价格 |
EMC Suppression(RID/Double-Aperture) |
|
| GT900SD120T2ZH-M | SILVERMICRO |
获取价格 |
IGBT Single-1200V |
|
| GT9128 | ETC |
获取价格 |
Segment-type 32x4 LCD Driver |
|
| GT9-12P-2.54DS | HRS |
获取价格 |
Developed for Equipment Exposed to Harsh Environmental Conditions |
|
| GT9-12P-2.54DS(05) | HRS |
获取价格 |
Developed for Equipment Exposed to Harsh Environmental Conditions |
|
| GT9-12P-2.54DS(70) | HRS |
获取价格 |
Board Connector, 12 Contact(s), 1 Row(s), Male, Right Angle, Solder Terminal, ROHS COMPLIA |
|
| GT9-12P-2.54DS05 | HRS |
获取价格 |
Developed for Equipment Exposed to Harsh Environmental Conditions |
|
解析光耦仿真器：升级光耦合器技术的必要性
英伟达新一代Blackwell GPU过热问题致交付延迟
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
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