1.8 Volt Intel® Dual-Plane Flash Memory
28F320D18 (x16)
Product Preview Datasheet
Product Features
■ 32-Mbit density with 16-Bit Data Bus
■ High Performance Reads
■ Flexible Blocking Architecture
— Eight, 4-Kword Parameter Code/Data Blocks
— 110/40 ns 4-Word Page Mode
— 40 MHz (110/20 ns) Zero Wait-State
Synchronous Burst Mode
— Sixty-three, 32-Kword Main Code/Data
Blocks
■ Enhanced Data Protection
■ Dual Partition Architecture
— VPP = GND Absolute Write Protection
— 25%/75% Partition Sizes
32 Mb 8 Mb + 24 Mb
— Erase/Program Lockout during Power
Transitions
— Program or Erase during Reads
— Status Register for Each Partition
■ Low Power Operation
— Individual Dynamic Zero-Latency Block
Locking
— Individual Block Lock-Down
■ Automated Program/Erase Algorithms
— 1.8 V Read and Write Operations
— VCCQ for I/O Isolation and System
Compatibility
— 1.8 V Low-Power 22 µs/Word (Typ)
Programming
— 12 V No Glue Logic 8 µs/Word (Typ)
Production Programming and 1.1 sec Erase
(Typ)
— Automatic Power Savings Mode
■ Enhanced Code + Data Storage
— Flash Data Integrator (FDI) Software
Optimized
— 5 µs Typical Program/Erase Suspends
■ 128-Bit Protection Register
■ Cross-Compatible Command Support
— Intel Basic Command Set
— Common Flash Interface (CFI)
■ Extended Temperature –40° C to +85° C
■ Minimum 100,000 Block Erase Cycles
■ ETOX™ VI Flash Technology (0.25 µm)
— 64 Unique Device Identifier Bits
— 64 User-Programmable OTP Bits
■ µBGA* CSP 60-Ball 7x8 Matrix (four support
balls)
The 1.8 Volt Intel® Dual-Plane Flash memory provides high performance asynchronous and synchronous
burst reads. It is an ideal memory for low-voltage burst CPUs. Combining high read performance with flash
memory’s intrinsic nonvolatility, 1.8 Volt Dual-Plane Flash memory eliminates the traditional system-
performance paradigm of shadowing redundant code memory from slow nonvolatile storage to faster
execution memory. It reduces the total memory requirement that increase reliability and reduces overall
system power consumption and cost.
The 1.8 Volt Dual-Plane Flash memory’s two partitions allow background programming or erasing to occur
in one partition while program-execution reads take place in the other partition. This allows for higher data
write throughput compared to single partition architectures. The dual partition architecture also allows two
processors to interleave code operations while program and erase operations take place in the background.
1.8 Volt Dual-Plane Flash memory is manufactured on Intel® 0.25 µm ETOX™ VI process technology. It is
available in an industry-standard µBGA* CSP package which is ideal for board-constrained applications.
Order Number: 290672-002
October 1999