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GT28F320C3BC100 PDF预览

GT28F320C3BC100

更新时间： 2024-11-26 10:40:59
品牌 Logo 应用领域
恒忆 - NUMONYX /
页数 文件大小 规格书
70页 903K
描述
Flash, 2MX16, 100ns, PBGA48, CSP, MICRO, BGA-48

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GT28F320C3BC100 数据手册

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3 Volt Advanced+ Boot Block Flash  
Memory  
28F800C3, 28F160C3, 28F320C3, 28F640C3 (x16)  
Preliminary Datasheet  
Product Features  
■ Flexible SmartVoltage Technology  
—2.7 V–3.6 V Read/Program/Erase  
—12 V for Fast Production Programming  
■ High Performance  
—2.7 V–3.6 V: 70 ns Max Access Time  
■ Optimized Architecture for Code Plus Data  
Storage  
■ Improved 12 V Production Programming  
—Faster Production Programming  
—No Additional System Logic  
■ 128-bit Protection Register  
—64-bit Unique Device Identifier  
—64-bit User Programmable OTP Cells  
■ Extended Cycling Capability  
—Minimum 100,000 Block Erase Cycles  
■ Supports Flash Data Integrator Software  
—Flash Memory Manager  
—Eight 4-Kword Blocks, Top or Bottom  
Locations  
—Up to One Hundred-Twenty-Seven 32-  
Kword Blocks  
—System Interrupt Manager  
—Fast Program Suspend Capability  
—Fast Erase Suspend Capability  
■ Flexible Block Locking  
—Supports Parameter Storage, Streaming  
Data (e.g., voice)  
■ Automated Word/Byte Program and Block  
—Lock/Unlock Any Block  
Erase  
—Command User Interface  
—Full Protection on Power-Up  
—WP# Pin for Hardware Block Protection  
—VPP = GND Option  
—Status Registers  
■ Cross-Compatible Command Support  
—Intel Basic Command Set  
—VCC Lockout Voltage  
—Common Flash Interface  
■ Low Power Consumption  
—9 mA Typical Read Power  
—7 µA Typical Standby Power with  
Automatic Power Savings Feature  
■ Extended Temperature Operation  
—–40 °C to +85 °C  
■ x16 I/O for Various Applications  
—48-Ball µBGA* Package  
—48-Ball VF BGA Package  
—64-Ball Easy BGA Package  
—48-Lead TSOP Package  
■ 0.18 µ ETOX™ VII Flash Technology  
The 3 Volt Advanced+ Boot Block Flash memory, manufactured on Intel’s latest 0.18 µ  
technology, represents a feature-rich solution for low power applications. 3 Volt Advanced+  
Boot Block Flash memory devices incorporate low voltage capability (2.7 V read, program and  
erase) with high-speed, low-power operation. Flexible block locking allows any block to be  
independently locked or unlocked. Add to this the Intel-developed Flash Data Integrator (FDI)  
software and you have a cost-effective, flexible, monolithic code plus data storage solution.  
Intel® 3 Volt Advanced+ Boot Block products will be available in 48-lead TSOP, 48-ball  
µBGA*, 48-ball Very Thin Profile Fine Pitch BGA (VF BGA), and 64-ball Easy BGA  
packages. Additional information on this product family can be obtained by accessing the Intel®  
Flash website: http://www.intel.com/design/flash.  
Notice: This document contains preliminary information on new products in production. The  
specifications are subject to change without notice. Verify with your local Intel sales office that  
you have the latest datasheet before finalizing a design.  
Order Number: 290645-009  
April 2000  
1234567...70

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