Datasheet > GSDC209C

GSDC209C

更新时间： 2024-04-09 18:59:52

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GSI		/
页数	文件大小	规格书
3页	701K
描述
209-bump BGA (14 mm x 22 mm) Daisy Chain Package (1st Generation)

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GSDC209C 数据手册

GSDC209C

209-Bump BGA (14 mm x 22 mm)

Daisy Chain Package

Description

This mechanical daisy chain test vehicle is designed to represent the 209-Bump BGA package. It is used for second level

interconnect assembly test and continuity verification.

Package Dimensions—209-Bump BGA (Package C)

14 mm x 22 mm Body, 1.0 mm Bump Pitch, 11 x 19 Bump Array

BOTTOM VIEW

Ø0.10

Ø0.30 C A B

Ø0.50~0.70 (209x)

A1 CORNER

TOP VIEW

11 10

9 10 11

1.0

10.0

14.0

0.20(4x)

SEATING PLANE

Rev: 1.02 12/2005

1/3

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

12 3

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