GSD2004WS
SURFACE MOUNT FAST SWITCHING DIODE
Features
Silicon Epitaxial Planar Diode
!
!
Fast switching diode,especially suited for
applications requiring high voltage capa-
A
bility
SOD-323
C
Dim
A
Min
2.30
1.75
1.15
0.25
0.05
0.70
0.30
Max
2.70
1.95
1.35
0.35
0.15
0.95
—
Mechanical Data
D
B
!
!
Case: SOD-323, Molded Plastic
B
C
Terminals: Plated Leads Solderable per
MIL-STD-202, Method 208
Polarity: Cathode Band
D
E
G
!
!
!
E
Weight: 0.004 grams (approx.)
Marking: A3
G
H
All Dimensions in mm
H
@ TA = 25°C unless otherwise specified
Maximum Ratings
Parameter
Test condition
Symbol
VR
Value
240
Unit
V
Continuous reverse voltage
Peak repetitive reverse voltage
Forward current (continuous)
Peak repetitive forward current
VRRM
IF
IFRM
IFSM
300
225
625
4.0
V
mA
mA
A
Non-repetitive peak forward
current
tp = 1 µs
tp = 1 s
IFSM
Ptot
1.0
A
2001)
Power dissipation
mW
1) Device on Fiberglass Substrate, see layout on second page
Tamb = 25 °C, unless otherwise specified
Thermal Characteristics
Parameter
Test condition
Symbol
Value
6501)
Unit
Typical thermal resistance
junction to ambient air
RthJA
°C/W
Junction temperature
Tj
150
°C
°C
Storage temperature range
TS
- 65 to + 150
1) Device on Fiberglass Substrate, see layout on second page
Tamb = 25 °C, unless otherwise specified
Electrical Characteristics
Parameter
Test condition
IR = 100 µA
Symbol
VBR
Min
300
Typ.
0.83
Max
Unit
V
Reverse breakdown voltage
Leakage current
VR = 240 V
IR
IR
100
100
0.87
1.00
5.0
nA
µA
V
VR = 240 V, Tj = 150 °C
IF = 20 mA
Forward voltage
VF
VF
Ctot
trr
IF = 100 mA
V
Diode capacitance
VF = VR = 0, f = 1 MHz
pF
ns
Reverse recovery time
IF = IR = 30 mA, Irr = 3.0 mA,
50
RL = 100 Ω
1) Device on Fiberglass Substrate, see layout
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