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GS88118BGD-200IV PDF预览

GS88118BGD-200IV

更新时间： 2024-11-26 04:56:31
品牌 Logo 应用领域
GSI 存储静态存储器
页数 文件大小 规格书
36页 1529K
描述
512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs

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GS88118BGD-200IV 技术参数

是否Rohs认证： 符合生命周期：Obsolete
零件包装代码：BGA包装说明：LBGA,
针数：165Reach Compliance Code：unknown
ECCN代码：3A991.B.2.BHTS代码：8542.32.00.41
风险等级：5.65最长访问时间：6.5 ns
其他特性：FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLYJESD-30 代码：R-PBGA-B165
JESD-609代码：e1长度：15 mm
内存密度：9437184 bit内存集成电路类型：CACHE SRAM
内存宽度：18湿度敏感等级：3
功能数量：1端子数量：165
字数：524288 words字数代码：512000
工作模式：SYNCHRONOUS最高工作温度：85 °C
最低工作温度：-40 °C组织：512KX18
封装主体材料：PLASTIC/EPOXY封装代码：LBGA
封装形状：RECTANGULAR封装形式：GRID ARRAY, LOW PROFILE
并行/串行：PARALLEL峰值回流温度（摄氏度）：260
认证状态：Not Qualified座面最大高度：1.4 mm
最大供电电压 (Vsup)：2 V最小供电电压 (Vsup)：1.7 V
标称供电电压 (Vsup)：1.8 V表面贴装：YES
技术：CMOS温度等级：INDUSTRIAL
端子面层：Tin/Silver/Copper (Sn/Ag/Cu)端子形式：BALL
端子节距：1 mm端子位置：BOTTOM
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：13 mm
Base Number Matches：1

GS88118BGD-200IV 数据手册

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GS88118/32/36B(T/D)-xxxV  
250 MHz–150 MHz  
100-pin TQFP & 165-bump BGA  
Commercial Temp  
512K x 18, 256K x 32, 256K x 36  
1.8 V or 2.5 V V  
DD  
9Mb Sync Burst SRAMs  
1.8 V or 2.5 V I/O  
Industrial Temp  
Flow Through/Pipeline Reads  
The function of the Data Output register can be controlled by  
the user via the FT mode pin (Pin 14). Holding the FT mode  
pin low places the RAM in Flow Through mode, causing  
output data to bypass the Data Output Register. Holding FT  
high places the RAM in Pipeline mode, activating the rising-  
edge-triggered Data Output Register.  
Features  
• IEEE 1149.1 JTAG-compatible Boundary Scan  
• 1.8 V or 2.5 V +10%/–10% core power supply  
• 1.8 V or 2.5 V I/O supply  
• LBO pin for Linear or Interleaved Burst mode  
• Internal input resistors on mode pins allow floating mode pins  
• Byte Write (BW) and/or Global Write (GW) operation  
• Internal self-timed write cycle  
• Automatic power-down for portable applications  
• JEDEC-standard 100-lead TQFP and 165-bump BGA  
packages  
• RoHS-compliant 100-lead TQFP and 165-bump BGA  
packages available  
SCD Pipelined Reads  
The GS88118/32/36B(T/D)-xxxV is a SCD (Single Cycle  
Deselect) pipelined synchronous SRAM. DCD (Dual Cycle  
Deselect) versions are also available. SCD SRAMs pipeline  
deselect commands one stage less than read commands. SCD  
RAMs begin turning off their outputs immediately after the  
deselect command has been captured in the input registers.  
Byte Write and Global Write  
Functional Description  
Byte write operation is performed by using Byte Write enable  
(BW) input combined with one or more individual byte write  
signals (Bx). In addition, Global Write (GW) is available for  
writing all bytes at one time, regardless of the Byte Write  
control inputs.  
Applications  
The GS88118/32/36B(T/D)-xxxV is a 9,437,184-bit high  
performance synchronous SRAM with a 2-bit burst address  
counter. Although of a type originally developed for Level 2  
Cache applications supporting high performance CPUs, the  
device now finds application in synchronous SRAM  
applications, ranging from DSP main store to networking chip  
set support.  
Sleep Mode  
Low power (Sleep mode) is attained through the assertion  
(High) of the ZZ signal, or by stopping the clock (CK).  
Memory data is retained during Sleep mode.  
Controls  
Core and Interface Voltages  
Addresses, data I/Os, chip enable (E1, E2), address burst  
control inputs (ADSP, ADSC, ADV) and write control inputs  
(Bx, BW, GW) are synchronous and are controlled by a  
positive-edge-triggered clock input (CK). Output enable (G)  
and power down control (ZZ) are asynchronous inputs. Burst  
cycles can be initiated with either ADSP or ADSC inputs. In  
Burst mode, subsequent burst addresses are generated  
internally and are controlled by ADV. The burst address  
counter may be configured to count in either linear or  
interleave order with the Linear Burst Order (LBO) input. The  
Burst function need not be used. New addresses can be loaded  
on every cycle with no degradation of chip performance.  
The GS88118/32/36B(T/D)-xxxV operates on a 1.8 V or 2.5 V  
power supply. All input are 1.8 V and 2.5 V compatible.  
Separate output power (V  
) pins are used to decouple  
DDQ  
output noise from the internal circuits and are 1.8 V and 2.5 V  
compatible.  
Paramter Synopsis  
-250  
-200  
-150  
Unit  
tKQ  
3.0  
4.0  
3.0  
5.0  
3.8  
6.7  
ns  
ns  
tCycle  
Pipeline  
3-1-1-1  
Curr (x18)  
Curr (x32/x36)  
200  
230  
170  
195  
140  
160  
mA  
mA  
tKQ  
5.5  
5.5  
6.5  
6.5  
7.5  
7.5  
ns  
ns  
tCycle  
Flow Through  
2-1-1-1  
Curr (x18)  
Curr (x32/x36)  
160  
185  
140  
160  
128  
145  
mA  
mA  
Rev: 1.00 6/2006  
1/36  
© 2006, GSI Technology  
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.  
1234567...36

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GS88118BGD-200T GSI

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 		Cache SRAM, 512KX18, 6.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-16
GS88118BGD-200V GSI

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 		512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs
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GS88118BGD-250IT GSI

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 		512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs
GS88118BGD-250IVT GSI

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 		暂无描述
GS88118BGD-250V GSI

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 		512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs
GS88118BGD-300 GSI

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 		512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs
GS88118BGD-300I GSI

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 		512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs

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