生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | LBGA, | 针数: | 165 |
Reach Compliance Code: | compliant | ECCN代码: | 3A991.B.2.B |
HTS代码: | 8542.32.00.41 | 风险等级: | 5.84 |
Is Samacsys: | N | 其他特性: | PIPELINED ARCHITECTURE |
JESD-30 代码: | R-PBGA-B165 | 长度: | 17 mm |
内存密度: | 75497472 bit | 内存集成电路类型: | DDR SRAM |
内存宽度: | 18 | 功能数量: | 1 |
端子数量: | 165 | 字数: | 4194304 words |
字数代码: | 4000000 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
组织: | 4MX18 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | LBGA | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, LOW PROFILE | 并行/串行: | SERIAL |
认证状态: | Not Qualified | 座面最大高度: | 1.5 mm |
最大供电电压 (Vsup): | 1.9 V | 最小供电电压 (Vsup): | 1.7 V |
标称供电电压 (Vsup): | 1.8 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子形式: | BALL | 端子节距: | 1 mm |
端子位置: | BOTTOM | 宽度: | 15 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
GS8672T18AGE-333IT | GSI |
获取价格 |
DDR SRAM, 4MX18, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-165 | |
GS8672T18BE-300I | GSI |
获取价格 |
DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, FBGA-165 | |
GS8672T18BE-300IT | GSI |
获取价格 |
DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, FBGA-165 | |
GS8672T19AE-300IT | GSI |
获取价格 |
DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 | |
GS8672T19AE-333 | GSI |
获取价格 |
DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 | |
GS8672T19AE-375I | GSI |
获取价格 |
DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 | |
GS8672T19AE-375IT | GSI |
获取价格 |
DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 | |
GS8672T19AE-375T | GSI |
获取价格 |
DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 | |
GS8672T19AE-400 | GSI |
获取价格 |
DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 | |
GS8672T19AE-400I | GSI |
获取价格 |
DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 |