GS82582DT19/37RE-350M/250M
GS81302DT19/37RE-350M/250M
GS8662DT19/37RE-350M/250M
350 MHz–250 MHz
Rad-Tolerant SRAM
288Mb/144Mb/72Mb Burst of 4 SigmaQuad-II+
165-Bump BGA
Military Temp
1.8 V V
DD
TM
1.8 V and 1.5 V I/O
Features
SigmaQuad™ Family Overview
• Aerospace-Level Product
The GS82582DT19/37, GS81302DT19/37, and
• 2.0 clock Latency
GS8662DT19/37 are built in compliance with the SigmaQuad-
II+ SRAM pinout standard for Separate I/O synchronous
SRAMs. They are 301,989,888-bit (288Mb), 150,994,944-bit
(144Mb), and 75,497,472-bit (72Mb) SRAMs. These
SigmaQuad SRAMs comprise a family of low power, low
voltage HSTL I/O Radiation-Tolerant (Rad-Tolerant) SRAMs
designed to operate in Radiation environments.
• Simultaneous Read and Write SigmaQuad™ Interface
• JEDEC-standard pinout and package
• Dual Double Data Rate interface
• Byte Write controls sampled at data-in time
• Burst of 4 Read and Write
• Dual-Range On-Die Termination (ODT) on Data (D), Byte
Write (BW), and Clock (K, K) inputs
• 1.8 V +100/–100 mV core power supply
• 1.5 V or 1.8 V HSTL Interface
Clocking and Addressing Schemes
The Rad-Tolerant SigmaQuad-II+ SRAMs are synchronous
devices. They employ two input register clock inputs, K and K.
K and K are independent single-ended clock inputs, not
differential inputs to a single differential clock input buffer.
• Pipelined read operation
• Fully coherent read and write pipelines
• ZQ pin for programmable output drive strength
• Data Valid Pin (QVLD) Support
• IEEE 1149.1 JTAG-compliant Boundary Scan
• 165-bump leaded BGA package
Each internal read and write operation in a SigmaQuad-II+ B4
RAM is four times wider than the device I/O bus. An input
data bus de-multiplexer is used to accumulate incoming data
before it is simultaneously written to the memory array. An
output data multiplexer is used to capture the data produced
from a single memory array read and then route it to the
appropriate output drivers as needed. Therefore, the address
field of a SigmaQuad-II+ B4 RAM is always two address pins
less than the advertised index depth (e.g., the 16M x 18 has a
4M addressable index).
Radiation Performance
• Total Ionizing Dose (TID) > 50krads(Si)
• Destructive Single Event Latchup Immunity >42.2 MeV.cm2/mg
(100C)
Parameter Synopsis
-350M
2.86 ns
0.45 ns
-250M
4.0 ns
tKHKH
tKHQV
0.45 ns
Rev: 1.01 3/2021
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© 2019, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.