5秒后页面跳转
GS84036CGB-250 PDF预览

GS84036CGB-250

更新时间: 2024-11-20 13:48:07
品牌 Logo 应用领域
GSI /
页数 文件大小 规格书
23页 635K
描述
119 BGA

GS84036CGB-250 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:BGA,Reach Compliance Code:compliant
ECCN代码:3A991.B.2.B风险等级:5.65
其他特性:IT ALSO OPERATES AT 3 TO 3.6 V SUPPLY VOLTAGEJESD-30 代码:R-PBGA-B119
长度:22 mm内存密度:4718592 bit
内存集成电路类型:CACHE SRAM内存宽度:36
功能数量:1端子数量:119
字数:131072 words字数代码:128000
工作模式:SYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:128KX36
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装形状:RECTANGULAR封装形式:GRID ARRAY
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
座面最大高度:1.99 mm最大供电电压 (Vsup):2.7 V
最小供电电压 (Vsup):2.3 V标称供电电压 (Vsup):2.5 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子形式:BALL
端子节距:1.27 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:14 mm
Base Number Matches:1

GS84036CGB-250 数据手册

 浏览型号GS84036CGB-250的Datasheet PDF文件第2页浏览型号GS84036CGB-250的Datasheet PDF文件第3页浏览型号GS84036CGB-250的Datasheet PDF文件第4页浏览型号GS84036CGB-250的Datasheet PDF文件第5页浏览型号GS84036CGB-250的Datasheet PDF文件第6页浏览型号GS84036CGB-250的Datasheet PDF文件第7页 
GS84018/32/36CB-250/200/166/150  
BGA  
Commercial Temp  
Industrial Temp  
250 MHz–150 MHz  
256K x 18, 128K x 32, 128K x 36  
4Mb Sync Burst SRAMs  
3.3 V V  
DD  
3.3 V and 2.5 V I/O  
internally and are controlled by ADV. The burst address  
Features  
counter may be configured to count in either linear or  
interleave order with the Linear Burst Order (LBO) input. The  
burst function need not be used. New addresses can be loaded  
on every cycle with no degradation of chip performance.  
• FT pin for user-configurable flow through or pipelined  
operation  
• Single Cycle Deselect (SCD) operation  
• 3.3 V +10%/–5% core power supply  
• 2.5 V or 3.3 V I/O supply  
Flow Through/Pipeline Reads  
• LBO pin for Linear or Interleaved Burst mode  
• Internal input resistors on mode pins allow floating mode pins  
• Default to Interleaved Pipelined mode  
• Byte Write (BW) and/or Global Write (GW) operation  
• Common data inputs and data outputs  
• Clock control, registered, address, data, and control  
• Internal self-timed write cycle  
The function of the Data Output register can be controlled by  
the user via the FT mode pin/bump (pin 14 in the TQFP and  
bump 5R in the BGA). Holding the FT mode pin/bump low  
places the RAM in Flow Through mode, causing output data to  
bypass the Data Output Register. Holding FT high places the  
RAM in Pipelined mode, activating the rising-edge-triggered  
Data Output Register.  
• Automatic power-down for portable applications  
• JEDEC-standard 119-bump BGA package  
• RoHS-compliant 119-bump BGA package  
SCD Pipelined Reads  
The GS84018/32/36C is an SCD (Single Cycle Deselect)  
pipelined synchronous SRAM. DCD (Dual Cycle Deselect)  
versions are also available. SCD SRAMs pipeline deselect  
commands one stage less than read commands. SCD RAMs  
begin turning off their outputs immediately after the deselect  
command has been captured in the input registers.  
Functional Description  
Applications  
The GS84018/32/36C is a 4,718,592-bit (4,194,304-bit for  
x32 version) high performance synchronous SRAM with a 2-  
bit burst address counter. Although of a type originally  
developed for Level 2 Cache applications supporting high  
performance CPUs, the device now finds application in  
synchronous SRAM applications ranging from DSP main store  
to networking chip set support. The GS84018/32/36A is  
available in a JEDEC standard 100-lead TQFP or 119-Bump  
BGA package.  
Byte Write and Global Write  
Byte write operation is performed by using byte write enable  
(BW) input combined with one or more individual byte write  
signals (Bx). In addition, Global Write (GW) is available for  
writing all bytes at one time, regardless of the Byte Write  
control inputs.  
Sleep Mode  
Low power (Sleep mode) is attained through the assertion  
(High) of the ZZ signal, or by stopping the clock (CK).  
Memory data is retained during Sleep mode.  
Controls  
Addresses, data I/Os, chip enables (E1, E2, E3), address burst  
control inputs (ADSP, ADSC, ADV), and write control inputs  
(Bx, BW, GW) are synchronous and are controlled by a  
positive-edge-triggered clock input (CK). Output enable (G)  
and power down control (ZZ) are asynchronous inputs. Burst  
cycles can be initiated with either ADSP or ADSC inputs. In  
Burst mode, subsequent burst addresses are generated  
Core and Interface Voltages  
The GS84018/32/36C operates on a 3.3 V power supply and all  
inputs/outputs are 3.3 V- and 2.5 V-compatible. Separate  
output power (V  
) pins are used to de-couple output noise  
DDQ  
from the internal circuit.  
Parameter Synopsis  
–250  
–200  
–166  
–150  
Unit  
tCycle  
tKQ  
Curr (X18)  
Curr (X32/X36)  
4.0  
2.5  
195  
225  
5.5  
3.0  
170  
195  
6.0  
3.5  
150  
185  
6.7  
3.8  
140  
160  
ns  
ns  
MHz  
MHz  
Pipeline  
3-1-1-1  
tKQ  
tCycle  
Curr (X18)  
Curr (X32/X36)  
5.5  
5.5  
160  
180  
6.5  
6.5  
140  
160  
7.0  
7.0  
140  
155  
7.5  
7.5  
128  
145  
Flow  
Through  
2-1-1-1  
ns  
ns  
MHz  
Rev: 1.01 9/2014  
1/23  
© 2014, GSI Technology  
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.  

与GS84036CGB-250相关器件

型号 品牌 获取价格 描述 数据表
GS84036CGB-250I GSI

获取价格

119 BGA
GS84036CGT-150 GSI

获取价格

Cache SRAM, 128KX36, 7.5ns, CMOS, PQFP100, ROHS COMPLIANT, TQFP-100
GS84036CGT-150I GSI

获取价格

100 TQFP
GS84036CGT-166 GSI

获取价格

Cache SRAM, 128KX36, 7ns, CMOS, PQFP100, ROHS COMPLIANT, TQFP-100
GS84036CGT-1660I GSI

获取价格

100 TQFP
GS84036CGT-166IT GSI

获取价格

Cache SRAM, 128KX36, 7ns, CMOS, PQFP100, ROHS COMPLIANT, TQFP-100
GS84036CGT-200 GSI

获取价格

Cache SRAM, 128KX36, 6.5ns, CMOS, PQFP100, ROHS COMPLIANT, TQFP-100
GS84036CGT-200I GSI

获取价格

Cache SRAM, 128KX36, 6.5ns, CMOS, PQFP100, ROHS COMPLIANT, TQFP-100
GS84036CGT-250 GSI

获取价格

Cache SRAM, 128KX36, 5.5ns, CMOS, PQFP100, ROHS COMPLIANT, TQFP-100
GS84036CGT-250I GSI

获取价格

100 TQFP