是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | BGA, |
针数: | 165 | Reach Compliance Code: | compliant |
ECCN代码: | 3A991.B.2.B | HTS代码: | 8542.32.00.41 |
风险等级: | 5.6 | 最长访问时间: | 7 ns |
其他特性: | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | JESD-30 代码: | R-PBGA-B165 |
JESD-609代码: | e1 | 长度: | 15 mm |
内存密度: | 18874368 bit | 内存集成电路类型: | ZBT SRAM |
内存宽度: | 36 | 湿度敏感等级: | 3 |
功能数量: | 1 | 端子数量: | 165 |
字数: | 524288 words | 字数代码: | 512000 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 组织: | 512KX36 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | BGA |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY |
并行/串行: | PARALLEL | 峰值回流温度(摄氏度): | 260 |
认证状态: | Not Qualified | 最大供电电压 (Vsup): | 2.7 V |
最小供电电压 (Vsup): | 2.3 V | 标称供电电压 (Vsup): | 2.5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式: | BALL | 端子节距: | 1 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 13 mm |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
GS8161Z36GD-166T | GSI |
获取价格 |
ZBT SRAM, 512KX36, 7ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 | |
GS8161Z36GD-200 | GSI |
获取价格 |
ZBT SRAM, 512KX36, 6.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 | |
GS8161Z36GD-200IT | GSI |
获取价格 |
ZBT SRAM, 512KX36, 6.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 | |
GS8161Z36GD-200T | GSI |
获取价格 |
ZBT SRAM, 512KX36, 6.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 | |
GS8161Z36GD-225 | GSI |
获取价格 |
ZBT SRAM, 512KX36, 6ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 | |
GS8161Z36GD-250I | GSI |
获取价格 |
ZBT SRAM, 512KX36, 5.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 | |
GS8161Z36GD-250IT | GSI |
获取价格 |
ZBT SRAM, 512KX36, 5.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 | |
GS8161Z36GD-250T | GSI |
获取价格 |
ZBT SRAM, 512KX36, 5.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 | |
GS8161Z36GT-133I | GSI |
获取价格 |
ZBT SRAM, 512KX36, 8.5ns, CMOS, PQFP100, TQFP-100 | |
GS8161Z36GT-133IT | GSI |
获取价格 |
ZBT SRAM, 512KX36, 8.5ns, CMOS, PQFP100, TQFP-100 |