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GS8161Z36GD-166IT PDF预览

GS8161Z36GD-166IT

更新时间: 2024-11-20 10:51:19
品牌 Logo 应用领域
GSI 静态存储器内存集成电路
页数 文件大小 规格书
36页 939K
描述
ZBT SRAM, 512KX36, 7ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165

GS8161Z36GD-166IT 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:BGA包装说明:BGA,
针数:165Reach Compliance Code:compliant
ECCN代码:3A991.B.2.BHTS代码:8542.32.00.41
风险等级:5.6最长访问时间:7 ns
其他特性:FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLYJESD-30 代码:R-PBGA-B165
JESD-609代码:e1长度:15 mm
内存密度:18874368 bit内存集成电路类型:ZBT SRAM
内存宽度:36湿度敏感等级:3
功能数量:1端子数量:165
字数:524288 words字数代码:512000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:512KX36
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装形状:RECTANGULAR封装形式:GRID ARRAY
并行/串行:PARALLEL峰值回流温度(摄氏度):260
认证状态:Not Qualified最大供电电压 (Vsup):2.7 V
最小供电电压 (Vsup):2.3 V标称供电电压 (Vsup):2.5 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:13 mm

GS8161Z36GD-166IT 数据手册

 浏览型号GS8161Z36GD-166IT的Datasheet PDF文件第2页浏览型号GS8161Z36GD-166IT的Datasheet PDF文件第3页浏览型号GS8161Z36GD-166IT的Datasheet PDF文件第4页浏览型号GS8161Z36GD-166IT的Datasheet PDF文件第5页浏览型号GS8161Z36GD-166IT的Datasheet PDF文件第6页浏览型号GS8161Z36GD-166IT的Datasheet PDF文件第7页 
GS8161Z18(T/D)/GS8161Z32(D)/GS8161Z36(T/D)  
100-Pin TQFP  
Commercial Temp  
Industrial Temp  
250 MHz–133 MHz  
18Mb Pipelined and Flow Through  
Synchronous NBT SRAM  
2.5 V or 3.3 V V  
DD  
2.5 V or 3.3 V I/O  
Because it is a synchronous device, address, data inputs, and  
read/ write control inputs are captured on the rising edge of the  
input clock. Burst order control (LBO) must be tied to a power  
rail for proper operation. Asynchronous inputs include the  
Sleep mode enable, ZZ and Output Enable. Output Enable can  
be used to override the synchronous control of the output  
drivers and turn the RAM's output drivers off at any time.  
Write cycles are internally self-timed and initiated by the rising  
edge of the clock input. This feature eliminates complex off-  
chip write pulse generation required by asynchronous SRAMs  
and simplifies input signal timing.  
Features  
• User-configurable Pipeline and Flow Through mode  
• NBT (No Bus Turn Around) functionality allows zero wait  
read-write-read bus utilization  
• Fully pin-compatible with both pipelined and flow through  
NtRAM™, NoBL™ and ZBT™ SRAMs  
• IEEE 1149.1 JTAG-compatible Boundary Scan  
• 2.5 V or 3.3 V +10%/–10% core power supply  
• LBO pin for Linear or Interleave Burst mode  
• Pin-compatible with 2M, 4M, and 8M devices  
• Byte write operation (9-bit Bytes)  
• 3 chip enable signals for easy depth expansion  
• ZZ pin for automatic power-down  
• JEDEC-standard 100-lead TQFP and 165-bump FP-BGA  
packages  
The GS8161Z18(T/D)/GS8161Z32(D)/GS8161Z36(T/D) may  
be configured by the user to operate in Pipeline or Flow  
Through mode. Operating as a pipelined synchronous device,  
in addition to the rising-edge-triggered registers that capture  
input signals, the device incorporates a rising-edge-triggered  
output register. For read cycles, pipelined SRAM output data is  
temporarily stored by the edge triggered output register during  
the access cycle and then released to the output drivers at the  
next rising edge of clock.  
Functional Description  
The GS8161Z18(T/D)/GS8161Z32(D)/GS8161Z36(T/D) is an  
18Mbit Synchronous Static SRAM. GSI's NBT SRAMs, like  
ZBT, NtRAM, NoBL or other pipelined read/double late write  
or flow through read/single late write SRAMs, allow  
utilization of all available bus bandwidth by eliminating the  
need to insert deselect cycles when the device is switched from  
read to write cycles.  
The GS8161Z18(T/D)/GS8161Z32(D)/GS8161Z36(T/D) is  
implemented with GSI's high performance CMOS technology  
and is available in JEDEC-standard 100-pin TQFP and  
165-bump FP-BGA packages.  
Parameter Synopsis  
-250 -225 -200 -166 -150 -133 Unit  
Pipeline  
3-1-1-1  
t
2.5 2.7 3.0 3.4 3.8 4.0 ns  
4.0 4.4 5.0 6.0 6.7 7.5 ns  
KQ  
tCycle  
Curr (x18)  
280 255 230 200 185 165 mA  
3.3 V  
2.5 V  
Curr (x32/x36) 330 300 270 230 215 190 mA  
Curr (x18) 275 250 230 195 180 165 mA  
Curr (x32/x36) 320 295 265 225 210 185 mA  
Flow  
Through  
2-1-1-1  
t
5.5 6.0 6.5 7.0 7.5 8.5 ns  
5.5 6.0 6.5 7.0 7.5 8.5 ns  
KQ  
tCycle  
Curr (x18)  
175 165 160 150 145 135 mA  
3.3 V  
2.5 V  
Curr (x32/x36) 200 190 180 170 165 150 mA  
Curr (x18) 175 165 160 150 145 135 mA  
Curr (x32/x36) 200 190 180 170 165 150 mA  
Rev: 2.15 11/2004  
1/36  
© 1998, GSI Technology  
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.  

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