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GS8152Z18B-150IT PDF预览

GS8152Z18B-150IT

更新时间: 2024-09-17 19:36:35
品牌 Logo 应用领域
GSI 时钟静态存储器内存集成电路
页数 文件大小 规格书
39页 757K
描述
ZBT SRAM, 1MX18, 10ns, CMOS, PBGA119

GS8152Z18B-150IT 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:BGA, BGA119,7X17,50Reach Compliance Code:compliant
风险等级:5.88最长访问时间:10 ns
最大时钟频率 (fCLK):150 MHzI/O 类型:COMMON
JESD-30 代码:R-PBGA-B119JESD-609代码:e0
内存密度:18874368 bit内存集成电路类型:ZBT SRAM
内存宽度:18湿度敏感等级:3
端子数量:119字数:1048576 words
字数代码:1000000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:1MX18输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装等效代码:BGA119,7X17,50封装形状:RECTANGULAR
封装形式:GRID ARRAY并行/串行:PARALLEL
电源:2.5/3.3,3.3 V认证状态:Not Qualified
最大待机电流:0.02 A最小待机电流:3.14 V
子类别:SRAMs最大压摆率:0.233 mA
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:BALL端子节距:1.27 mm
端子位置:BOTTOMBase Number Matches:1

GS8152Z18B-150IT 数据手册

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Preliminary  
GS8152Z18/36/72B-225/200/180/166/150/133  
119 and 209 BGA  
Commercial Temp 16Mb Pipelined and Flow Through 225MHz133MHz  
3.3 V V  
DD  
Industrial Temp  
Synchronous NBT SRAM  
2.5 V or 3.3 V I/O  
Features  
Functional Description  
• NBT (No Bus Turn Around) functionality allows zero wait  
Read-Write-Read bus utilization; fully pin-compatible with  
both pipelined and flow through NtRAM™, NoBL™ and  
ZBT™ SRAMs  
• 3.3 V +10%/–5% core power supply  
• 2.5 V or 3.3 V I/O supply  
The GS8152Z18/36/72B is a 16Mbit Synchronous Static  
SRAM. GSI's NBT SRAMs, like ZBT, NtRAM, NoBL or  
other pipelined read/double late write or flow through read/  
single late write SRAMs, allow utilization of all available bus  
bandwidth by eliminating the need to insert deselect cycles  
when the device is switched from read to write cycles.  
• User-configurable Pipeline and Flow Through mode  
• ZQ mode pin for user-selectable high/low output drive  
• IEEE 1149.1 JTAG-compatible Boundary Scan  
• On-chip write parity checking; even or odd selectable  
• On-chip parity encoding and error detection  
• LBO pin for Linear or Interleave Burst mode  
• Pin-compatible with 2M, 4M, and 8M devices  
• Byte write operation (9-bit Bytes)  
Because it is a synchronous device, address, data inputs, and  
read/write control inputs are captured on the rising edge of the  
input clock. Burst order control (LBO) must be tied to a power  
rail for proper operation. Asynchronous inputs include the  
Sleep mode enable (ZZ) and Output Enable. Output Enable can  
be used to override the synchronous control of the output  
drivers and turn the RAM's output drivers off at any time.  
Write cycles are internally self-timed and initiated by the rising  
edge of the clock input. This feature eliminates complex off-  
chip write pulse generation required by asynchronous SRAMs  
and simplifies input signal timing.  
• 3 chip enable signals for easy depth expansion  
• ZZ Pin for automatic power-down  
• JEDEC-standard 119- or 209-Bump BGA package  
-225 -200 -180 -166 -150 -133 Unit  
The GS8152Z18/36/72B may be configured by the user to  
operate in Pipeline or Flow Through mode. Operating as a  
pipelined synchronous device, in addition to the rising-edge-  
triggered registers that capture input signals, the device  
incorporates a rising edge triggered output register. For read  
cycles, pipelined SRAM output data is temporarily stored by  
the edge-triggered output register during the access cycle and  
then released to the output drivers at the next rising edge of  
clock.  
Flow  
tKQ  
7.0 7.5 8.0 8.5 10.0 11.0 ns  
8.5 10.0 10.0 10.0 10.0 15.0 ns  
205 185 185 185 185 140 mA  
240 210 210 210 210 160 mA  
325 285 285 285 285 205 mA  
Through  
2-1-1-1  
tCycle  
Curr (x18)  
Curr (x36)  
Curr (x72)  
Pipeline  
3-1-1-1  
tKQ  
tCycle  
2.5 3.0 3.2 3.5 3.8 4.0 ns  
4.4 5.0 5.5 6.0 6.7 7.5 ns  
350 315 290 270 250 230 mA  
410 370 340 315 290 260 mA  
570 515 470 435 400 360 mA  
Curr (x18)  
Curr (x36)  
Curr (x72)  
The GS8152Z18/36/72B is implemented with GSI's high  
performance CMOS technology and is available in a JEDEC-  
Standard 119-bump (x18 & x36) or 209-bump (x72) BGA  
package.  
Flow Through and Pipelined NBT SRAM Back-to-Back Read/Write Cycles  
Clock  
Address  
A
R
B
C
R
D
E
R
F
Read/Write  
W
W
W
Flow Through  
Data I/O  
QA  
DB  
QC  
DD  
QE  
Pipelined  
Data I/O  
QA  
DB  
QC  
DD  
QE  
Rev: 1.01 11/2000  
1/39  
© 2000, Giga Semiconductor, Inc.  
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.  
NoBL is a trademark of Cypress Semiconductor Corp.. NtRAM is a trademark of Samsung Electronics Co.. ZBT is a trademark of Integrated Device Technology, Inc.  

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