GS3A THRU GS3M
50V-1000V 3.0A
SURFACE MOUNT GENERAL PURPOSE RECTIFIERS
FEATURES
The plastic package carries Underwriters Laboratory
Flammability Classification 94V-0
For surface mounted applications
Low reverse leakage
Built-in strain relief,ideal for automated placement
High forward surge current capability
High temperature soldering guaranteed:
250 C/10 seconds at terminals
Glass passivated chip junction
MECHANICAL DATA
Case: JEDEC DO-214AB molded plastic body over passivated chip
Terminals: Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight:0.007 ounce, 0.25grams
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(single-phase, half-wave, 60HZ, resistive or inductive load rating at 25℃, unless otherwise stated,
for capacitive load, derate current by 20%)
GS
3A
50
GS
3B
100
GS
3D
200
GS
3G
400
GS
3J
600
GS
3K
800
GS
3M
1000
SYMBOL
units
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Vrrm
Vrms
Vdc
V
V
V
35
50
70
140
200
280
400
420
600
560
800
700
Maximum DC blocking Voltage
100
1000
Maximum Average Forward Rectified Current
3/8″lead length at TL =75℃
Peak Forward Surge Current 8.3ms single half
sine-wave superimposed on rated load
Maximum Forward Voltage at rated Forward
current
If(av)
Ifsm
Vf
3.0
100.0
1.1
A
A
V
5.0
250
Maximum DC Reverse Current
at rated DC blocking voltage
Ta =25℃
Ta =125℃
Ir
uA
Typical Reverse Recovery Time
Typical Junction Capacitance
(Note 1)
(Note 2)
Trr
Cj
2.3
us
60.0
pF
Rth(ja)
Rth(jl)
Rth(jc)
Tstg
47.0
Typical Thermal Resistance
(Note 3)
13.0
℃/W
28.0
Storage and Operating Temperature Range
-50 to +150
℃
Note:
1. Reverse Recovery Condition If =0.5A, Ir =1.0A, Irr =0.25A
2. Measured at 1.0 MHz and applied voltage of 4.0Vdc
3. Thermal Resistance from junction to ambient and from junction to lead mounted on 8×8mm copper pad area
E-mail: sales@taychipst.com
Web Site: www.taychipst.com
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