GS1000F - GS1010F
SURFACE MOUNT SILICON RECTIFIER DIODES
VOLTAGE RANGE: 50 - 1000V
CURRENT: 1.0 A
Features
For surface mounted applications
Low profile package
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!
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Ideal for automated placement
High temperaturesoldering : 260°C /10
seconds at terminals
B
!
Glass Passivated Chip Junction
C
E
Mechanical Data
SMAF
Dim Min Max Typ
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Case: SMAF,Molded Plastic
Terminals: Solder Plated, Solderable
D
A
B
C
D
E
H
L
4.75 4.85
3.68 3.72
4.80
3.70
2.60
1.00
H
per MIL-STD-750, Method 2026
Polarity:Color band denotes cathode end
Mounting Position:Any
2.57
2.63
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L
0.097 1.03
1.38 1.42 1.40
0.13 0.17 0.15
0.63 0.67 0.65
Weight:0.0018 ounce, 0.064 grams
E
All Dimensions in mm
A
TA = 25ꢀC unless otherwise specified
Maximum Ratings and Electrical Characteristics
For capacitive load, derate current by 20%.
Single phase, half wave, 60Hz, resistive or inductive load.
Symbol
GS1000F GS1002F GS1003F GS1004F GS1006F GS1008F GS1010F
Characteristic
Unit
Marking
FA
FB
FD
FG
FJ
FK
FM
Maximum repetitive peak reverse voltage
VRRM
50
100
200
400
600
800
1000
700
V
V
Maximum RMS voltage
VRMS
35
50
70
140
200
280
400
420
600
560
800
Maximum DC blocking voltage
1000
100
VDC
V
A
Maximum average forward rectified current
I(AV)
1.0
25.0
1.1
at TA=65 C (NOTE 1)
Peak forward surge current
8.3ms single half sine-wave superimposed on
IFSM
A
V
rated load (JEDEC Method)
TL=25 C
VF
IR
Maximum instantaneous forward voltage at 1.0A
Maximum DC reverse current
at rated DC blocking voltage
TA=25 C
10.0
50.0
µ
A
TA=125 C
pF
Typical junction capacitance (NOTE 2)
Typical thermal resistance (NOTE 3)
4
CJ
RθJA
K/W
65
Operating junction and storage temperature range
TJ,TSTG
-50 to +150
C
Note:
1.Averaged over any 20ms period.
2.Measured at 1MHz and applied reverse voltage of 4.0V D.C.
3.Thermal resistance from junction to ambient at 0.375” (9.5mm)lead length,P.C.B. mounted
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