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GRM155R61C225KE11 PDF预览

GRM155R61C225KE11

更新时间: 2024-02-25 01:37:18
品牌 Logo 应用领域
EMMICRO /
页数 文件大小 规格书
67页 1285K
描述
5.0 LOW-ENERGY COMPANION OR SOC

GRM155R61C225KE11 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:, 0402
Reach Compliance Code:compliantECCN代码:EAR99
Factory Lead Time:14 weeks风险等级:1.35
Samacsys Description:Multilayer Ceramic Capacitors MLCC - SMD/SMT 0402 2.2uF 16volts X5R 10%电容:2.2 µF
电容器类型:CERAMIC CAPACITOR介电材料:CERAMIC
高度:0.5 mmJESD-609代码:e3
长度:1 mm安装特点:SURFACE MOUNT
多层:Yes负容差:10%
端子数量:2最高工作温度:85 °C
最低工作温度:-55 °C封装形状:RECTANGULAR PACKAGE
封装形式:SMT包装方法:TR, PAPER, 7 INCH
正容差:10%额定(直流)电压(URdc):16 V
尺寸代码:0402表面贴装:YES
温度特性代码:X5R温度系数:15% ppm/ °C
端子面层:Matte Tin (Sn) - with Nickel (Ni) barrier端子形状:WRAPAROUND
宽度:0.5 mmBase Number Matches:1

GRM155R61C225KE11 数据手册

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EM MICROELECTRONIC - MARIN SA  
EM9304  
OPTIMIZED  
5.0 LOW-ENERGY COMPANION OR SOC  
Description  
Main Features  
The EM9304 is a tiny, low-power, integrated circuit (IC)  
optimized for Bluetooth® 5.0 low energy enabled products. The  
flexible architecture of the EM9304 allows it to act as a  
companion IC to any ASIC or MCU-based product, or as a  
complete System-on-Chip (SoC). Custom applications can  
execute from one-time-programmable (OTP) memory, and  
digital peripherals (SPI or I2C) can be used to interface with  
external devices such as sensors, memory, display, or touch  
drivers. A floating point unit can be exploited to implement  
advanced algorithms such as sensor fusion.  
System-on-Chip:  
Energy efficient, industry standard, ARC EM4, 32-bit  
MCU running at 24MHz  
Floating-point unit for sensor processing  
136kB ROM including link layer and stack  
128kB OTP for parameters, profiles, and applications  
– 24MHz execution speed  
48kB instruction RAM and 28kB data RAM  
4, 8, or 20kB with selectable data retention  
Universal, sleep, and protocol timers  
I2C and SPI master interfaces  
Included in ROM is a Bluetooth 5.0 link layer with a Host  
Controller Interface (HCI), a Bluetooth stack with proprietary  
Application Controller Interface (ACI), several profiles, and  
over-the-air firmware (FOTA) updating routines. The Bluetooth  
low energy controller and host can be configured to support up  
to eight simultaneous connections. Secure connections and  
extended packet length are also supported.  
Up to 12 GPIO  
Bluetooth 5.0 Low Energy Technology:  
BT 5.0 Controller Subsystem (QD ID 93999)  
Bluetooth stack (QD ID 84268) in ROM  
SPI and UART HCI/ACI Transport Layers  
Up to eight simultaneous connections supported  
Extended PDU length and enhanced security  
Security Features:  
The EM9304 includes  
a
sophisticated on-chip power  
management system with automatic configuration for 1.5V or  
3V batteries. Current consumption is minimized for all modes  
of the application utilizing an efficient scheduler and memory  
manager. Several memory configuration options allow for  
optimum performance for any given application. A stable, low-  
power sleep oscillator (RC or crystal based) minimizes power  
consumption while in a connected state.  
True Random Number Generator  
AES-128 Hardware Encryption Engine  
Key Generation (ECC-P256)  
The EM9304 features a state-of-the-art 2.4GHz transceiver: an  
extremely  
low-power  
receiver  
with  
excellent  
Firmware Over-the-Air Updating  
sensitivity/selectivity, and a programmable transmitter for  
optimized output power and current consumption.  
Per application, function, or configuration  
Sophisticated Power Management System:  
Digital step-up/down DCDC operation  
Supports 1.5V and 3.0V batteries  
Scheduler and memory manager  
Low frequency RC or crystal oscillator time base  
Low Current Consumption at 3V:  
The PCB footprint and cost is minimized with a very low  
external component count and several package options. The  
circuit is offered in a WLCSP25 wafer level chip-scale package,  
a plastic QFN-28 package, and bare die/ wafer form. The  
device and reference design is qualified over the industrial  
temperature range.  
Customer support for PCB design, and FCC/CE certification  
are available. A hardware and software development kit are  
available, including commercially available tools with IDE and  
debugger. A website and forum are also available to help with  
your custom developments.  
3.0mA typical peak receiver current  
5.2mA typical peak transmitter current at 0.4dBm  
1.0µA connected sleep mode  
5nA chip disable mode  
High Performance RF:  
-94dBm Bluetooth low energy receiver sensitivity for  
1Mpbs operation and 37 byte payload  
-34 to +6.1dBm transmitter output power range  
Low Component Count and Cost:  
3 DC caps, 1 DCDC coil, 1 ferrite bead  
Single ended 50antenna pin (no balun)  
48MHz XTAL, 32kHz XTAL (optional)  
Packaging:  
QFN-28 (4x4mm), WLCSP25, and bare-die/wafer  
Industrial Operating Temperature Range: -40C to +85C  
Customer Support:  
Hardware, software development kits  
FCC/CE certification support  
Forum for hardware and software support  
1
www.emmicroelectronic.com  
Copyright 2017, EM Microelectronic-Marin SA  
9304-DS, Version 4.1, 30-Oct-17  

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